Electronic Device With Collimating Pattern Layer for Display Resolution
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Solution Overview
Problem
The challenge of improving display device resolution is limited by the inability to accurately place micro-elements in sub-pixels due to miniaturization constraints in mass-transfer techniques, leading to suboptimal display performance.
Innovation Solution
A manufacturing method involving a driving module with a light emitting element and a collimating pattern layer, including a first semiconductor layer, light emitting layer, and second semiconductor layer, with a top surface that is uneven, and a collimating pattern layer with specific structures to enhance light collimation and pixel alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mass-transfer technique is used to transfer micro-elements to substrate, then manufacturing process is simplified, but manufacturing precision deteriorates due to inability to accurately place micro-elements in sub-pixels
Solution Approach 1:
The patent divides the manufacturing process into separate stages: first forming micro-elements on a carrier substrate, then transferring them to the display substrate. This segmentation allows for precise placement control during the transfer process, resolving the contradiction between manufacturing simplicity and placement accuracy.
Solution Approach 2:
The patent introduces a carrier substrate as an intermediary to hold micro-elements during manufacturing and transfer. This intermediary enables precise control of micro-element placement while simplifying the overall manufacturing process, as the carrier can be easily handled and transferred.
2Measurement precision
If resolution of display device is improved by miniaturization, then display quality improves, but device complexity increases due to limited space for micro-element transfer
Solution Approach 1:
The patent utilizes the vertical dimension by forming micro-elements on a carrier substrate before transferring to the display substrate. This dimensional approach allows for precise placement in the horizontal plane while managing complexity through a systematic transfer process, enabling high resolution without excessive complexity.
3Illumination intensity
If top surface of semiconductor layer is made uneven, then light collimation is improved, but manufacturing precision deteriorates due to surface irregularity
Solution Approach 1:
The patent applies different surface characteristics to different regions of the semiconductor layer. The top surface is intentionally made uneven in specific areas to improve light collimation, while other regions maintain appropriate flatness for manufacturing. This localized approach resolves the contradiction between light collimation and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances display resolution by improving light collimation and pixel alignment, allowing for higher pixel density and better display quality.
Implementation Method 1
a collimating pattern layer with specific structures to enhance light collimation
Implementation Method 2
a collimating pattern layer with specific structures to enhance light collimation
Implementation Method 3
a light emitting layer
Data Source
AI summary
An electronic device is provided and includes a driving module, a light emitting element disposed on the driving module, and a collimating pattern layer disposed on the light emitting element. The light emitting element includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer, wherein a top surface of the first semiconductor layer is uneven. The collimating pattern layer includes a plurality of structures.