Identification Means TRIZ Cases

An optimized 60–240 micron cover plate with a 3–7 GPa tensile modulus helps prevent encapsulation and touch-layer cracking during scrolling.

Local transmittance and segmented pixel-circuit layouts balance camera light access, display resolution, and screen-to-body ratio.

An inorganic insulating layer shields the back channel from etching damage, smoothing its surface and reducing electrical defects.

Parallel middle portions in adjacent display routing lines equalize resistance, reducing RC delay variation and luminance differences.

Large tiled screens can expose seams and suffer thermal mismatch; light-blocking conductive adhesive and matched substrates improve immersion and display reliability.

A low-haze protective layer with controlled wavefront properties helps transmit camera signals through the display for clear imaging.

Integrating anti-reflection and shock-absorbing layers protects flexible display bends while limiting added layers, dead space, and manufacturing complexity.

A removable test-pad substrate separates testing from the final display panel, simplifying cutting and supporting narrower bezels.

Angled light-blocking layers and groove-filled reflecting patterns recycle light while limiting color mixing between adjacent pixels.

An inorganic pixel definition layer covers the organic contact-hole sidewall, blocking water vapor and improving subsequent film-layer yield.

Different adhesion strengths under the display and in the overlap area let the flexible substrate fold while protecting metal-layer wiring.

Micro-element transfer limits pixel placement in miniaturized displays; an uneven semiconductor surface and patterned layer improve collimation and alignment.

Protective and reflective layers surround micro-LED semiconductor stacks to minimize deterioration and extend display element lifespan.

Inclined light-blocking surfaces and a groove-filled reflecting pattern redirect stray light, improving efficiency and limiting color mixing.

An inorganic pixel defining layer segments emission areas without a mask process, while banks limit moisture ingress that can cause mura and damage.

A transparent OLED region without driving elements exposes a camera without a hole, preserving display area, strength, and dust/waterproofing.

A low-phase-difference base layer and thin inorganic barrier protect foldable displays while preserving visibility and moisture resistance.

Stacked light guide layers and light-blocking units separate color paths, preventing blur and brightness loss in multi-color luminous images.

An elastic layer in perforated regions reinforces inner side walls, reducing packaging-layer rupture during display stretching and bending.

Selective etching forms separated light-emitting elements without a mask while aligned electrode surfaces limit moisture permeation and mura.

Organic particles from OLED pixel patterning can disrupt performance; inorganic overhangs support evaporation deposition and encapsulation without lift-off.

See how stacked emission structures with n-type and p-type charge generation layers improve light efficiency and extend element lifespan.

A foldable third panel lets multi-directional displays collapse, bringing adjacent panels closer for compact storage.

Protective elements along display wires use stacked insulating films to shield oxide-semiconductor TFTs from manufacturing ESD and moisture.

A groove in the light-emitting element and a scattering layer improve light extraction while supporting reliable common-electrode contact.

A pre-shaped metal plate and bottom-to-top pressing apply tensile force at curved corners, preventing buckling and wrinkling in display panels.

Flat, protruding, and pad sections contact after bending, simplifying lower-member manufacture while supporting display-panel integrity.

An intermediary resin layer cushions pressing forces during component attachment, helping prevent display-panel damage and moisture ingress.

Through-holes in the insulation pattern let adhesive reach underlying layers, improving signal-pad bonding while reducing electrical-short risk.

A silicon nitride intermediary layer blocks oxygen and hydrogen diffusion, improving molybdenum adhesion while limiting TFT threshold-voltage shifts.

See how an LED chip layout in the display substrate preserves edge spacing for more efficient tiling of large display panels.

Pattern grooves in the light blocking member let the refractive layer fill the grooves, limiting impurity ingress while preserving light extraction.

Reverse-tapered bank walls and tapered spacers help limit folding stress, suppress encapsulation cracks and OLED separation, and preserve luminance consistency.

Larger anti-corrosion contact holes and connection-securing holes help prevent display wiring breaks during spin cleaning.

Chemical etching separates protected glass areas by gravity, avoiding cutting damage and producing stress-dissipation edges.

Connected positioning structures align light-emitting and color conversion areas during panel assembly, preventing displacement and optical crosstalk.

Reversed-taper holes in folding-area color filters help suppress reflection while limiting peeling and cracking during folding.

Concave through-electrode grooves and fitted bonding electrodes help prevent pixel-to-emitter disconnections and improve display manufacturing yield.

Signal lines avoid the first display sub-region while pixel circuits support under-screen sensing and uniform image quality.

Quantum dot and light-transmitting layers use controlled pixel, bank, and filter opening geometry to improve light conversion efficiency.