Ultra-Thin Glass Substrate Etching for Clean Edge Separation
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Solution Overview
Problem
Existing methods for manufacturing ultra-thin glass substrates face challenges such as edge breakages and microcracks during cutting, especially when using scribing wheel cutting or laser cutting, which can lead to defects and scrapage, and the process of applying a protection ink layer is difficult to ensure uniformity and cleanliness.
Innovation Solution
A method involving the formation of an etching protection layer on both surfaces of the glass substrate areas, followed by etching in a reaction chamber with support members to form stress dissipation edges, allowing the substrate areas to separate cleanly and form a stress dissipation edge, eliminating the need for scribing wheel and laser cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If scribing wheel cutting is used to cut ultra-thin glass substrates, then the cutting process is simple and fast, but the glass substrate suffers from edge breakages, microcracks, and other defects due to mechanical pressure
Solution Approach 1:
The patent replaces the mechanical scribing wheel cutting system with a chemical etching system. The glass substrate is immersed in an etching solution that chemically removes material to create the desired patterns and edges, eliminating mechanical contact and pressure that cause edge breakages and microcracks while maintaining efficient processing
2Manufacturing precision
If laser cutting is used to cut ultra-thin glass substrates, then no mechanical pressure is applied and cutting precision is improved, but the process is slower and more complex
Solution Approach 1:
The patent replaces the laser cutting system with a chemical etching system that uses etching solutions to remove glass material. This chemical approach achieves clean, precise edges comparable to laser cutting while significantly reducing processing time and equipment complexity
Solution Approach 2:
The patent controls the etching process by adjusting parameters such as etching solution concentration, temperature, and immersion time to achieve precise edge quality and cutting patterns, matching or exceeding laser cutting precision while improving productivity
3Reliability
If protection ink layer is sprayed on ultra-thin glass substrates, then the substrate is protected from scratches and damage, but the spraying process is difficult to control for uniformity and cleanliness
Solution Approach 1:
The patent removes the complex spraying process entirely by applying the protection layer through a dip-coating method. The substrate is simply immersed in the protection layer solution, which automatically forms a uniform coating as the substrate is withdrawn, eliminating all spraying control issues related to uniformity and cleanliness
4Adaptability or versatility
If ultra-thin glass substrates are cut to small sizes with irregular edges, then the design flexibility is improved, but the edge defects from cutting increase and require additional polishing steps
Solution Approach 1:
The patent uses chemical etching instead of mechanical or laser cutting to create irregular edges and fillets. The etching solution naturally forms smooth, defect-free edges regardless of pattern complexity, enabling design flexibility without compromising edge quality or requiring additional polishing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents damage from cutting methods, simplifies the manufacturing process, enhances stress dissipation effects, and improves the quality of ultra-thin glass substrates by ensuring clean separation and uniform application of protection layers.
Implementation Method 1
immersing the glass base material having the etching protection layer in a reaction chamber having etching medium, wherein the etching medium at least etches the skeleton area of the glass base material
Data Source
AI summary
A method for manufacturing ultra-thin glass substrates and a method for manufacturing a display panel are provided. The method for manufacturing ultra-thin glass substrates includes: providing a glass base material preset with n substrate areas and a skeleton area surrounding the substrate areas; at least forming an etching protection layer on each substrate area of the glass base material; immersing the glass base material in a reaction chamber having etching medium; after the edge of each substrate area is etched to form the stress dissipation edge and the substrate areas are separated from the glass base material, the substrate areas falling down by gravity and falling into the basket; pulling the basket out of the reaction chamber to get the substrate areas separated from the glass base material; removing the etching protection layer to get independent glass substrates.