Color Optoelectronic Solid State Device Stacking
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Solution Overview
Problem
Existing optoelectronic solid-state array devices face challenges in forming efficient color arrays with high resolution and compactness, particularly in wearable electronics like augmented reality devices, where alignment accuracy is difficult and bulkiness is a concern.
Innovation Solution
The solution involves stacking multiple monolithic semiconductor layers on a backplane with strategically positioned pads to create sub-pixels, modulating resistance in contact layers, and using a linear color combinator with a reflector to combine light from different sources, allowing for compact and high-resolution color displays with reduced alignment requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple monolithic microdevices are stacked to form color arrays, then color display capability is improved, but alignment accuracy becomes difficult to achieve
Solution Approach 1:
The patent segments the color display into multiple monolithic microdevice layers (e.g., red, green, blue layers), with each layer containing microdevices of a specific color. This segmentation allows independent fabrication and bonding of each layer to the backplane, reducing the complexity of achieving precise alignment for all colors simultaneously while maintaining high-resolution color display capability
Solution Approach 2:
The patent transitions from planar color array formation to three-dimensional stacking of monolithic microdevice layers. By bonding multiple layers vertically to the backplane, the system achieves color display functionality without requiring complex lateral alignment, as each layer is positioned in its own dimensional plane, thereby simplifying the alignment process while maintaining high resolution
2Measurement precision
If multiple monolithic microdevices are stacked to increase resolution, then pixel density is improved, but device compactness deteriorates
Solution Approach 1:
The patent implements a nested structure where multiple monolithic microdevice layers are stacked vertically, with each layer containing microdevices that are bonded to the backplane. This nesting approach allows high pixel density to be achieved by stacking layers rather than expanding laterally, thereby maintaining device compactness while increasing resolution through vertical integration of red, green, and blue microdevice layers
Solution Approach 2:
The patent utilizes the vertical dimension by stacking monolithic microdevice layers one on top of another, each layer contributing to the overall pixel density. This three-dimensional arrangement allows high resolution to be achieved without proportionally increasing the device footprint, thereby maintaining compactness while achieving high pixel density through vertical stacking of color layers
3Ease of operation
If resistance modulation is applied to contact layers, then pixelation control is improved, but manufacturing complexity increases
Solution Approach 1:
The patent modifies the electrical parameters of the contact layers by modulating their resistance values. By adjusting the resistance of contact layers in different regions, the patent achieves precise control over current distribution and pixelation characteristics. This parameter change approach allows flexible pixelation control during device operation while using standard semiconductor fabrication techniques, thereby managing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of high-resolution, compact color arrays with improved pixelation and alignment accuracy, suitable for wearable electronics, by modulating resistance and using a linear color combinator to combine light effectively.
Implementation Method 1
modulating a resistance of contact layers of the microdevice to create pixelation
Implementation Method 2
combining light colors from different image sources using a linear color combinator
Implementation Method 3
redirecting light generated by different image sources using a reflector
Data Source
AI summary
Structures and methods are disclosed for fabricating a color optoelectronic solid state array device. In one embodiment, different color devices are combined to form a color optoelectronic solid state array. The micro device array comprises stacked layers, monolithic devices and backplanes. In addition, reflectors, image sources, light sensors and dichroic mirrors have been integrated.