Colored Photosensitive Resin Composition for 300 nm Micro-Patterning
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Solution Overview
Problem
Conventional colored photosensitive resin compositions for solid state imaging devices face challenges in forming high-resolution, micro-patterned colored patterns using ultra-short wavelength exposure devices of 300 nm or less, as they exhibit poor hardening efficiency and sensitivity.
Innovation Solution
A colored photosensitive resin composition comprising a colorant, binder resin, photopolymerizable compound, and a photoinitiator, specifically using acetophenone-, benzophenone-, or oxime ester-based photoinitiators, which react at wavelengths of 300 nm or less, to achieve high-resolution micro-patterns with improved sensitivity and line characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional colored photosensitive resin composition is used with ultra-short wavelength exposure device of 300 nm or less, then micro-patterning of colored patterns is achieved, but hardening efficiency and sensitivity deteriorate
Solution Approach 1:
The patent changes the chemical composition parameters of the photosensitive resin by incorporating specific photoinitiators (acetophenone, benzophenone, or oxime ester compounds) that are activated at wavelengths of 300 nm or less. This parameter change enables the resin to achieve both high-resolution micro-patterning and efficient hardening under ultra-short wavelength exposure, resolving the contradiction between manufacturing precision and reliability.
2Manufacturing precision
If conventional colored photosensitive resin composition is used with ultra-short wavelength exposure device of 300 nm or less, then micro-patterning of colored patterns is achieved, but sensitivity and resolution deteriorate
Solution Approach 1:
The patent modifies the photoinitiator parameters of the resin composition to include compounds with high sensitivity to ultra-short wavelength light (300 nm or less). This parameter change enables the system to achieve both high pattern resolution and high exposure sensitivity, eliminating the trade-off between manufacturing precision and measurement precision.
3Ease of manufacture
If dye is used to form colored patterns, then colored patterns can be formed, but heat resistance and lightfastness deteriorate
Solution Approach 1:
The patent uses a composite material system combining pigment particles with a photosensitive resin matrix containing specific photoinitiators. This composite approach allows the pigment to provide color while the resin matrix provides heat resistance and lightfastness, resolving the contradiction between ease of manufacture and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the fabrication of high-resolution, micro-patterned colored patterns with small exposure energy doses, suitable for solid state imaging devices, particularly with pattern sizes of 1.4 μm or less, enhancing the reliability and quality of color filters.
Implementation Method 1
a photopolymerizable compound, and a photoinitiator, specifically using acetophenone-, benzophenone-, or oxime ester-based photoinitiators, which react at wavelengths of 300 nm or less
Data Source
AI summary
Disclosed is a colored photosensitive resin composition for a color filter of a solid state imaging device using an ultra-short wavelength exposing device of 300 nm or less, a color filter and a solid state imaging device including the same. The colored photosensitive resin composition can fabricate a color filter having a micro-patterned colored pattern. The color filter can be advantageously applied to a solid state imaging device.