3D Columnar IO Chiplets for Programmable Logic Fabric

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Solution Overview

Problem

Embedding columnar input/output (IO) circuits within programmable logic fabrics disrupts the performance of logic operations due to sizeable breaks in the fabric, leading to reduced IO density and increased process complexity.

Innovation Solution

Implementing IO chiplets in a three-dimensional configuration above or below the programmable logic fabric main die, with die-to-die drivers embedded within the fabric to manage IO operations, allowing for higher IO density without disrupting the fabric's continuity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If columnar IOs are embedded directly into the programmable logic fabric, then IO count is increased, but fabric continuity is disrupted causing performance degradation

Engineering Contradiction:

ImproveIO countVSAvoidfabric performance

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The patent transitions from two-dimensional shoreline IO placement to three-dimensional columnar IO structures that extend vertically through the fabric. This dimensional change allows IOs to be embedded without creating large horizontal breaks, as the vertical columns minimize disruption to the fabric's horizontal connectivity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces dedicated IO column structures as intermediary elements that mediate between the fabric logic and external IOs. These columns act as buffer zones, allowing IO operations to occur without directly disrupting the fabric's logic operations, thus maintaining fabric continuity while enabling increased IO count.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Quantity of substance

If columnar IOs are embedded within the programmable logic fabric, then IO density is increased, but process complexity increases

Engineering Contradiction:

ImproveIO densityVSAvoidprocess complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent segments the IO functionality into separate columnar structures distributed throughout the fabric, rather than concentrating all IOs at the shoreline. This segmentation allows each column to be independently managed and configured, simplifying the overall process by creating modular, repeatable units that can be systematically integrated into the fabric.

Inventive Principle:

Principle #1Segmentation

3Quantity of substance

If IOs are placed closer to the fabric, then IO density is improved, but additional area is required

Engineering Contradiction:

ImproveIO densityVSAvoiddevice area

Core Design Contradiction:

Quantity of substanceVSArea of stationary object

Solution Approach 1:

The patent implements IO columns that are nested within the fabric structure itself, rather than placing them externally. The IO columns are integrated into the fabric's vertical space, utilizing the third dimension to house IO functionality without expanding the horizontal footprint of the device.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS20220337250A1Three-Dimensional Columnar Input-Output (IO) Circuitry for Integrated Circuit Device

Publication Date: 2022.10.20 ALTERA CORP

AI summary

This disclosure is directed to methods of disaggregating columnar IO operations from a programmable logic fabric using 3-D packaging technology. More specifically, methods of 3-D programmable fabric arrangements that include one or more IO chiplets stacked in a 3-D orientation on a programmable logic fabric main die that includes one or more D2D drivers to enable communication between the one or more IO chiplets and the programmable logic fabric main die. The IO chiplets may be coupled to the programmable fabric main die through connection to the one or more D2D drivers arranged on the programmable fabric main die.