Common Mode Filter Surface Reforming Adhesion

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Solution Overview

Problem

Existing common mode filters face challenges with low adhesion between coil layers, high resistance, and manufacturing defects such as cracks, which affect their electrical performance and cost-effectiveness.

Innovation Solution

A common mode filter design featuring a coil part with insulating layers containing fillers, where surface reforming layers with reduced filler content are used to improve adhesion, and a magnetic resin composite is employed in the cover parts to enhance magnetic permeability and flexibility, reducing the risk of cracks and improving handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conductive paste is used to form coils in multilayer common mode filter, then manufacturing process is simple, but coil pattern precision is low and resistance is high

Engineering Contradiction:

Improvecoil formation processVSAvoidcoil pattern precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent changes the material parameter from conductive paste to thin-film conductive material, and changes the formation method parameter from screen printing to sputtering or CVD, thereby achieving both low resistance and high precision coil patterns

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical screen printing process with a vacuum deposition process (sputtering or CVD), substituting mechanical material transfer with physical/chemical vapor deposition to achieve precise thin-film coil formation

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If thin film type common mode filter is used with coating method, then manufacturing cost is low, but close adhesion between layers is low

Engineering Contradiction:

Improvemanufacturing costVSAvoidclose adhesion between layers

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent uses a composite structure with polymer resin base layer and silane coating layer, combining the advantages of both materials: polymer provides low cost and flexibility, while silane provides strong adhesion and moisture resistance

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The silane coating acts as an intermediary layer between the polymer resin layers, providing chemical bonding that enhances adhesion between stacked thin-film layers while maintaining the low-cost coating manufacturing process

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If entire thickness of common mode filter is reduced by bonding magnetic layer to ferrite substrate, then miniaturization is achieved, but handling problems occur and yield is reduced due to cracks

Engineering Contradiction:

Improvefilter thicknessVSAvoidyield due to cracks

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent replaces the rigid ferrite substrate with a flexible polymer resin substrate, allowing the thin-film structure to bend and deform without cracking, thereby maintaining reliability while achieving miniaturization

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the substrate material parameter from ceramic (ferrite) to polymer resin, fundamentally altering the mechanical properties to provide flexibility and crack resistance while maintaining the thin-film configuration

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS9954510B2Common mode filter

Publication Date: 2018.04.24 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A common mode filter includes a coil part in which a plurality of insulating layers having coils formed on one surfaces thereof and containing fillers are stacked; a first cover part disposed beneath the coil part; and a second cover part disposed on the coil part, wherein surface reforming layers improving close adhesion between the insulating layers are formed on at least one surfaces of the insulating layers.