Multiple-Port Networks TRIZ Cases

Switch devices tune total capacitance at common ports, reducing insertion losses during filter switching without adding components.

An inductor device integrates a low-resistance shunt resistor to enable precise current sensing within steering control systems.

Adjusting filter unit capacitance via capacitive members to match reference frequency characteristics.

Opposite-oriented receptacles isolate filter elements from ground inductors, preventing magnetic interference and spark generation during power cycles.

A planar differential inductor integrates an interior structure to establish a strong on-chip AC ground.

A phase filter injects a ground monitor signal into an equipment grounding conductor to trigger visual flashing indicators on energized phase conductors.

A power conversion device uses a low-pass filter and control section to manage AC output voltage.

Lumped component elements replace quarter-wave transmission lines to reduce signal loss and IC area for compact integration.

Photodefinable glass-ceramic substrates create mechanically stabilized transmission lines, reducing insertion loss for compact RF devices.

A resonance matching circuit uses timing adjustment to enable zero-cross operations in voltage type inverters.

Vertical ground plane structure separates adjacent semiconductor filter devices to minimize cross-coupling between channels.

Directly connecting a capacitor to an exposed conductor eliminates inductive noise propagation caused by side-by-side branch wires.

A high-power multiplexer separates broadband RF signals into disjoint frequency ranges using reactive elements and bandpass filters.

A self-connected LC filter design integrates shunt and coupling inductors directly into a patterned metal layer on a dielectric substrate.

Switches connect additional transmission line lengths to a Marchand balun, reducing substrate loss across multiple frequency bands.

Ferrite suppressors cancel parasitic resonance in transmission lines, enabling 1.8 GHz operation without physical redesign.

Intersecting linear conductive patterns increase inductance and Q values without expanding the multilayer LC filter profile.

Parallel sub-varactors with distinct bias voltages combine non-linear responses to stabilize oscillator gain.

Surface reforming layers with reduced filler content improve adhesion between insulating layers, reducing cracks and manufacturing defects.

A non-resonant grid coil design enables unconstrained MR-induced current flow across arbitrary three-dimensional surfaces.

Separating capacitors and coils across laminated layers reduces magnetic interference, improving insertion loss and phase difference.

A filter device uses skewed magnetic fields to reduce coupling between resonators.

Opposed lead-out patterns and unequal coil diameters compensate resistance differences to improve high-frequency performance.

BEOL wiring switches dynamically tune delay and impedance, compensating for process variations to reduce jitter and latency variability.

A power converter injects disturbances to measure capacitor resonance frequencies for health estimation.

Transistor-controlled bandstop filters attenuate disturbing frequencies at antenna switch ports, reducing device size and cost in multiband mobile devices.

A tuning line and antenna tuner transform impedance to stabilize wireless communication when user proximity distorts the antenna radiator.

Stacked coil conductors with overlapping connections reduce stray capacitance and signal loss for reliable high-speed data transmission.

A carrier extension unit inserts edge data to enable power-of-two FFT processing in OFDM receivers.

Resonant TANK filters integrate into medical device lead wires to attenuate RF currents at specific frequencies.

Resistive isolation in a pi-type attenuator replaces DC block capacitors, enabling low-frequency operation and reducing chip area.

Autotuning RF matching network settings via local controller minimizes reflected power, eliminating recipe re-qualification time.

A coupling element electromagnetically decouples ground current to feed back into the signal path.

Orienting inductor loops at an angle creates magnetic coupling to generate sufficient attenuation poles near the pass band while maintaining wide bandwidth.

Segmented differential-mode filtering reduces recirculation currents without increasing coupling inductor weight.

A skew-CDR circuit adjusts timing error clock phase relative to data sampling latches.

A wide-band coupler uses signal splitters and filters to extract power from multiple frequency bands.

Dynamic tap order selection optimizes interference suppression while managing device complexity in wideband radio channels.

Intrinsically switched filters with power-dependent coupling elements attenuate high-power signals without affecting adjacent channels or degrading group delay.

A via transmission line uses signal and ground vias with a clearance hole to form a wave guiding channel.

A stability controller detects plasma oscillations and adjusts load impedance to maintain power delivery.

Three-dimensional conductor crossing maintains electromagnetic coupling, canceling parasitic inductance despite positional deviations between inductors.

A matching device adjusts output impedance to regulate plasma processing harmonics.

A forward-biased reverse diode pair reduces resistance to radio frequency waves while maintaining high voltage tolerance.

Synchronized switches convert direct current into time-varying square wave signals, reducing tissue exposure risk in implantable medical devices.

Integrated capacitive divider monitors resistance drift in high-voltage pulse attenuators, eliminating the need for external measurement devices.

Curved signal conductors span reference plane voids to equalize impedance, reducing distortion without adding layers or stitching capacitors.

Polarity-reversed inductor coupling cancels stray capacitance, enabling flat frequency characteristics and reliable high-speed signal integrity.

A millimeter wave switch uses a matching FET to control characteristic impedance at the connection end.