Compact Backlight Component with 360° Semiconductor Chips
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Solution Overview
Problem
Existing backlighting components with multiple LEDs are costly and not suitable for compact applications due to their size, which limits their use in various applications and optical performance.
Innovation Solution
A compact backlight component featuring a radiation-transparent substrate with semiconductor chips arranged for 360° light emission, where the substrate's transmittance and structured surface optimize light distribution, and the use of converter layers for color adjustment, combined with a thin-film design and planar interconnects for cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple 360° emitting LEDs are used to achieve homogeneous illumination, then the illumination quality is improved, but the component size and cost increase
Solution Approach 1:
The invention segments the light emission function by using a single semiconductor chip with multiple emission zones or multiple chips arranged in a compact configuration on a small substrate, rather than using many individual LEDs. This segmentation allows homogeneous illumination to be achieved through distributed emission points while maintaining a compact overall component size.
Solution Approach 2:
The invention merges multiple light emission functions into a single integrated component structure where semiconductor chips are mounted on a compact radiation-transparent substrate. This consolidation achieves homogeneous illumination through the combined emission of multiple chips while reducing the overall component size compared to traditional multi-LED assemblies.
2Illumination intensity
If multiple 360° emitting LEDs are used to achieve homogeneous illumination, then the illumination quality is improved, but the manufacturing cost increases
Solution Approach 1:
The invention merges multiple semiconductor chips onto a single radiation-transparent substrate in a compact arrangement, achieving homogeneous illumination through their combined emission. This integrated approach reduces manufacturing cost by simplifying the assembly process and reducing the number of individual components compared to traditional multi-LED backlighting units.
Solution Approach 2:
The invention changes the operational parameters by using semiconductor chips that can be driven in configurations to produce homogeneous illumination patterns. By optimizing the arrangement and emission characteristics of the chips on the substrate, the system achieves desired illumination quality with reduced component count and lower manufacturing cost.
3Adaptability or versatility
If the component size is reduced for compact applications, then the adaptability is improved, but the mechanical stability deteriorates
Solution Approach 1:
The invention uses a thin, radiation-transparent substrate to mount the semiconductor chips, creating a compact component structure. This thin-film approach enables the component to be adapted to various compact applications while maintaining mechanical stability through the rigid yet thin substrate material that provides structural support.
Solution Approach 2:
The invention segments the component into a thin substrate with mounted chips, allowing the overall structure to be compact and adaptable while distributing mechanical stresses across the substrate and mounting structure. This segmentation maintains mechanical stability despite the reduced component size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable, cost-effective, and optically enhanced backlighting solution with improved mechanical stability and homogeneous illumination, suitable for diverse applications, while minimizing material costs and light loss.
Implementation Method 1
The active zone is designed for generating electromagnetic radiation and can be a pn-junction zone
Implementation Method 2
the semiconductor chip has a converter layer with phosphors, wherein the phosphors are designed to convert short-wave radiation components into long-wave radiation components
Implementation Method 3
an electrically insulating and radiation-transparent substrate and at least one semiconductor chip arranged on the substrate
Data Source
AI summary
The invention relates to a component (100) having an electrically insulating and radiation-transparent substrate (9) and at least one semiconductor chip (10) arranged on the substrate (9). The semiconductor chip (10) is designed to generate electromagnetic radiation and has a front side (11) and a rear side (12) facing away from the front side (11), wherein the front side (11) of the semiconductor chip (10) faces the substrate (9) and is designed as a radiation exit face of the semiconductor chip (10), and wherein the rear side (12) of the semiconductor chip (10) faces away from the substrate (9), wherein the semiconductor chip (10) can be electrically contacted externally via the rear side (12). The invention further relates to a method for producing such a component.