Compensation Component for Thermal Expansion Mismatch
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Solution Overview
Problem
Existing cooling systems for electronic components face challenges in ensuring effective heat dissipation and electrical insulation across varying temperatures due to differing thermal expansion coefficients and thicknesses of materials, leading to potential damage from temperature-dependent forces.
Innovation Solution
A compensation component with cuboid-shaped thermally conductive layers separated by elongated, elastically deformable heat transfer elements, such as copper pins, connects materials while compensating for mechanical forces and ensuring heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If different materials are used for the heat sink and cooling plate, then thermal conductivity is improved, but temperature-dependent forces arise due to different coefficients of thermal expansion
Solution Approach 1:
The patent introduces a compensation component as an intermediary element between the heat sink and cooling plate. This compensation component has a first material layer matching the heat sink material and a second material layer matching the cooling plate material, allowing each interface to have compatible thermal expansion coefficients while maintaining good thermal contact.
Solution Approach 2:
The compensation component uses a composite structure with at least two different material layers. Each layer is made of a different material selected to match the thermal expansion coefficient of the adjacent component (heat sink or cooling plate), creating a gradient structure that progressively compensates for expansion differences.
2Productivity
If different thicknesses are used for the heat sink and cooling plate, then heat dissipation efficiency is improved, but mechanical forces arise due to differential length changes with temperature
Solution Approach 1:
The patent changes the physical parameters of the compensation component, specifically making it elastically deformable. This allows the compensation component to accommodate differential length changes through elastic deformation rather than rigid constraint, absorbing the mechanical forces that would otherwise damage the connection.
Solution Approach 2:
The compensation component is designed to be dynamically adaptable through elastic deformation. Rather than being a rigid fixed structure, it can flex and deform elastically in response to temperature-induced length changes, maintaining connection integrity while allowing the heat sink and cooling plate to have different thicknesses.
3Device complexity
If direct connection is made between heat sink and cooling plate, then device complexity is reduced, but electrical insulation is compromised when both are metallic
Solution Approach 1:
The compensation component serves multiple functions simultaneously: it provides thermal conduction pathways, electrical insulation between metallic components, and mechanical compensation for thermal expansion differences. This multi-functionality is achieved by selecting appropriate materials for each layer and designing the overall structure to fulfill all requirements.
4Reliability
If compensation component with multiple material layers is used, then thermal expansion compatibility is improved, but device complexity increases
Solution Approach 1:
The compensation component is segmented into multiple material layers, with each layer serving a specific function. The first material layer interfaces with the heat sink, the second material layer interfaces with the cooling plate, and intermediate layers provide transition and compensation. This segmentation allows each layer to be optimized for its specific interface while collectively solving the thermal expansion compatibility problem.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively transfers heat and compensates for mechanical stresses, maintaining electrical insulation and thermal conductivity across temperature changes, preventing damage and enhancing cooling efficiency.
Implementation Method 1
several elongated, in particular cylindrical, preferably elastically deformable heat transfer elements, preferably made of the first material, extend between the two material layers for the transfer of heat from one material layer to the other
Implementation Method 2
several elongated, in particular cylindrical, preferably elastically deformable heat transfer elements, preferably made of the first material, extend between the two material layers for the compensation of different mechanical forces occurring at an angle, preferably perpendicular to their respective longitudinal extent
Data Source
Figure 1~2
Figure 3~4
AI summary
The invention relates to a compensation component comprising a first, preferably cuboid, material layer (11) made of thermally conductive material, in particular of a first type of material, preferably metal, and a second, preferably cuboid, material layer (12) made of thermally conductive material, in particular of another second, preferably electrically non-conductive material, in particular ceramic, extending at a distance from the first material layer (11), in particular in a plane parallel to it, wherein several, in particular each bendable at an angle, preferably perpendicular to their respective longitudinal extent, parallel, elongated, in particular cylindrical, spaced apart from each other, are arranged between the two material layers (11, 12) for the transfer of heat from one to the other material layer (11, 12) and for the compensation of different mechanical forces occurring at an angle, in particular perpendicular to their respective longitudinal extent.Preferably elastically deformable heat transfer elements (13) made of a thermally conductive material, preferably of the first type of material.