Compliant Needle for Direct Semiconductor Die Transfer

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Solution Overview

Problem

Conventional semiconductor device fabrication processes result in packaged devices that are significantly larger and thicker than the underlying semiconductor dies, limiting the thickness and efficiency of circuit assemblies due to the need for protective packaging, which increases manufacturing time and cost.

Innovation Solution

A machine and process for directly transferring unpackaged semiconductor dies from a wafer tape to a product substrate, reducing the thickness of the final product by precisely aligning and affixing the dies without packaging, using a transfer mechanism that includes a needle to separate the dies from the wafer tape and a fixing mechanism to secure them to the substrate, potentially using a laser to enhance adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If semiconductor devices are packaged in conventional plastic or ceramic packages, then the devices are protected from environmental degradation, but the packaged devices become significantly larger and thicker (around 10 times the thickness and area, 100 times the volume)

Engineering Contradiction:

Improveprotection from environmental degradationVSAvoiddevice size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent extracts the protective packaging from the semiconductor device structure, transitioning from packaged devices to unpackaged dies. The dies are transferred directly to the circuit substrate without being enclosed in plastic or ceramic packages, eliminating the bulk associated with conventional packaging while maintaining functional integrity through direct mounting and bonding.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If conventional packaging processes are used, then devices are protected and ready for circuit assembly, but the manufacturing time and cost increase

Engineering Contradiction:

Improvedevice protectionVSAvoidmanufacturing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent removes the packaging step entirely from the manufacturing process flow. Instead of dicing wafers into packaged devices, the process directly transfers unpackaged dies to circuit substrates, eliminating the time-consuming packaging operations while maintaining device protection through the substrate mounting structure.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the die transfer process with the circuit assembly process, combining what were previously separate operations (packaging then mounting) into a single direct transfer and mount operation, thereby reducing total manufacturing time and process steps.

Inventive Principle:

Principle #5Merging (Combining)

3Volume of moving object

If unpackaged dies are transferred directly to circuit substrates, then the thickness and volume of the final product are reduced, but the handling and transfer precision requirements increase

Engineering Contradiction:

Improveproduct thicknessVSAvoiddie transfer alignment

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent introduces a transfer mechanism with a pickup element (such as a needle or gripper) as an intermediary tool to handle the unpackaged dies. This mediator enables precise pickup, transport, and placement of the small dies onto the circuit substrate, managing the precision requirements through controlled mechanical transfer rather than direct manual handling.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs automated mechanical transfer systems with controlled motion and positioning to replace manual handling, ensuring precise alignment and placement of unpackaged dies. The use of automated pick-and-place mechanisms with controlled trajectories and positioning systems manages the precision requirements through engineering control rather than human skill.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the thickness and manufacturing time of semiconductor-based products, enhancing efficiency and cost-effectiveness by eliminating the need for protective packaging, allowing for thinner and more compact circuit assemblies.

Implementation Method 1

a transfer mechanism that includes a needle to separate the dies from the wafer tape

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Implementation Method 2

a fixing mechanism to secure them to the substrate, potentially using a laser to enhance adhesion

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 3

potentially using a laser to enhance adhesion

Methodology Applied

Scientific EffectLaser heating: Laser

Data Source

PatentUS10141215B2Compliant needle for direct transfer of semiconductor devices

Publication Date: 2018.11.27 ROHINNI LLC

AI summary

An apparatus includes a needle and a needle actuator to move the needle to a position at which the needle presses an electrically-actuatable element into contact with a circuit trace. When the needle presses the electrically-actuatable element into contact with the circuit trace, a dampener, arranged with the needle and the needle actuator, dampens a force applied to the electrically-actuatable element.