Compliant Printed Circuit Test Socket for IC Peripheral Leads
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Solution Overview
Problem
Traditional peripheral lead integrated circuit test sockets face challenges with limited mechanical and electrical performance, high production costs, and the need for precise performance windows, often leading to premature replacement and increased costs due to degradation and wear on the circuit board.
Innovation Solution
The use of precision additive printed circuit fabrication techniques to create compliant printed circuits that provide temporary electrical contact to IC device terminals, allowing for high-frequency performance, reduced production costs, and extended mechanical life through the integration of compliant materials and on-board electrical devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional precision machining operations are used to produce plastic socket housings, then manufacturing precision is improved, but production cost increases
Solution Approach 1:
The patent replaces traditional mechanical precision machining operations with additive printing technology to manufacture socket housings. This substitution eliminates complex machining processes while maintaining manufacturing precision through digital modeling and layer-by-layer construction, significantly reducing production costs for low-volume custom sockets.
Solution Approach 2:
The invention changes the manufacturing approach from subtractive machining to additive fabrication. This parameter change in the manufacturing process enables cost-effective production of precision housings by building structures layer-by-layer from digital designs, avoiding expensive machining setup and tooling costs.
2Force
If elastomeric materials are used to bias contact members, then contact force is improved, but electrical performance degrades due to signal distortion
Solution Approach 1:
The patent uses thin flexible printed circuit board (FPCB) structures instead of traditional elastomeric materials to provide contact bias force. The FPCB's inherent flexibility provides the necessary spring force while maintaining rigid trace paths for electrical signals, eliminating the signal distortion caused by elastomeric deformation and improving high-frequency electrical performance.
Solution Approach 2:
The invention combines rigid conductive traces with flexible substrate materials in a composite FPCB structure. This composite approach allows the substrate to provide mechanical compliance and contact force while the rigid conductive traces maintain stable electrical pathways, separating the mechanical and electrical functions to avoid signal degradation.
3Reliability
If contact members are made shorter to reduce distortion, then electrical performance is improved, but mechanical robustness decreases
Solution Approach 1:
The patent employs flexible printed circuit board structures that provide mechanical robustness through their laminated construction and rigid trace geometry, while keeping the electrical path length short. The FPCB's layered structure offers mechanical strength comparable to or exceeding traditional elastomeric springs, yet maintains the short electrical pathways needed for high-frequency performance.
4Manufacturing precision
If custom production methods are used for small socket volumes, then manufacturing precision is improved, but production cost increases
Solution Approach 1:
The patent replaces traditional custom machining processes with additive printing technology for manufacturing socket housings. This substitution enables cost-effective production of small volumes by eliminating expensive machining setup, tooling, and programming costs, while maintaining high precision through digital modeling and automated layer-by-layer construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution offers improved electrical performance, reduced capital costs, and increased yields by enabling the creation of multi-layer structures with varied material sets, enhancing signal integrity and allowing for adaptive testing and extended use of legacy test equipment.
Implementation Method 1
A conductive material is deposited into a plurality of cavities or recesses in the fixture
Implementation Method 2
The conductive material is sintered to form a plurality of contact members
Data Source
AI summary
A test socket that provides a temporary interconnect between terminals on an integrated circuit (IC) device and contact pads on a test printed circuit board (PCB). The test socket includes a compliant printed circuit and a socket housing. The compliant printed circuit includes at least one compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located along a second major surface, and a plurality of conductive traces electrically coupling the first and second contact members. The compliant layer is positioned to bias the first contact members against the terminals on the IC device and the second contact members against contact pads on the test PCB. The socket housing is coupled to the compliant printed circuit so the first contact members are positioned in a recess of the socket housing sized to receive the IC device.