Component Bridge for TOSA Mounting Surface Area
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Optical transceiver modules face challenges in increasing channel configurations beyond four channels to achieve transmission speeds in excess of 100 Gb/s due to space constraints, thermal management, and manufacturing complexity, particularly in hermetically-sealed TOSA housings, which limit the available component mounting surface area.
Innovation Solution
A component bridge is introduced that couples to a feedthrough device within the TOSA housing, providing additional component mounting surface area through a conductive body with a notched profile, allowing for electrical components like filtering capacitors to be mounted securely and reducing the need for wire bonds, thus minimizing signal degradation and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetically-sealed housings are used in TOSA to reduce loss and ensure optical performance, then optical performance is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention divides the internal mounting structure into modular components: the base feedthrough device and the separate component bridge assembly. This segmentation allows the hermetically-sealed housing to maintain its integrity while the component bridge provides additional mounting capability without requiring complex reconfiguration of the sealed environment, thus reducing manufacturing complexity while preserving optical performance.
Solution Approach 2:
The component bridge is nested within the hermetically-sealed housing cavity, coupling to the feedthrough device internally. This nesting approach allows additional component mounting surface area to be added within the existing sealed volume without compromising the hermetic seal or requiring external modifications, thereby maintaining optical performance while simplifying manufacturing.
2Speed
If component density is increased within space-constrained housings to achieve higher transmission speeds, then transmission speed is improved, but thermal management challenges increase
Solution Approach 1:
The component bridge extends the mounting surface in the vertical dimension within the housing cavity, creating multiple elevation levels (base feedthrough surface and elevated bridge surface). This vertical dimensionality allows additional components to be mounted without increasing the horizontal footprint, enabling higher component density and transmission speeds while maintaining thermal management through distributed component placement across different heights.
3Reliability
If the number of electrical interconnections is reduced to minimize signal degradation, then signal quality is improved, but component mounting flexibility decreases
Solution Approach 1:
The component bridge serves multiple functions simultaneously: it provides additional component mounting surface area, establishes electrical interconnections through its conductive body, and maintains signal integrity by providing direct electrical pathways. This multi-functionality allows components to be mounted flexibly while minimizing the need for additional wire bonds or complex interconnection structures, thus preserving signal quality.
Data Source
AI summary
The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.