Component Built-in Board Wiring Layer Gap Design
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Solution Overview
Problem
Conventional multi-layer printed wiring boards face challenges in thinning and deformation due to thick insulator spacers and complex manufacturing processes, leading to warping and increased thickness, which complicates the integration of electronic components.
Innovation Solution
A component built-in board with a multi-layer structure featuring unit boards and electronic components, where the intermediate board has a wiring layer overlapping the gap between the electronic component and the insulating layer, reducing the need for insulator spacers and simplifying the manufacturing process by using adhesive layers to prevent adhesive flow and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick insulator spacers are used to house electronic components between printed wiring boards, then the electronic component can be securely built in, but the overall board thickness increases and the manufacturing process becomes complicated
Solution Approach 1:
The patent removes the thick insulator spacer from the structure and replaces it with a wiring board that has a wiring layer formed in the space between the opening inner periphery and the electronic component outer periphery. This extraction of the insulator spacer directly reduces the overall board thickness while maintaining the electronic component housing function through the wiring layer configuration.
Solution Approach 2:
The wiring board serves multiple functions: it provides structural support, houses the electronic component through the opening, and replaces the insulator spacer's spacing function through its wiring layer. The wiring layer is formed at a position overlapping the gap between the opening inner periphery and the electronic component outer periphery, creating a multi-functional structure that eliminates the need for separate insulator spacers.
2Reliability
If thick insulator spacers are used between printed wiring boards, then electronic components can be housed, but the manufacturing steps become complicated
Solution Approach 1:
The patent merges the insulator spacer function and the wiring board function into a single structure. The wiring board includes both the opening for housing the electronic component and the wiring layer formed in the gap area, combining what were previously separate components (insulator spacer + wiring board) into one integrated unit, thereby simplifying the manufacturing process.
Solution Approach 2:
The wiring board is designed to perform multiple functions simultaneously: it provides the opening for electronic component housing, acts as a structural support, and the wiring layer formed in the gap area replaces the insulator spacer's spacing and insulation functions. This multi-functionality reduces the number of manufacturing steps by eliminating the need to separately process and assemble insulator spacers.
3Strength
If adhesive layer flows into the space during stacking, then bonding occurs, but the printed wiring boards deform in thickness direction causing overall warping
Solution Approach 1:
The patent removes the insulator spacer that created the problematic space for adhesive flow. By forming the wiring layer directly in the gap between the opening inner periphery and the electronic component outer periphery on the wiring board, there is no separate space for adhesive to flow into, preventing the deformation and warping that occurred with the insulator spacer structure.
Solution Approach 2:
The wiring layer acts as an intermediary structure that fills the gap between the opening and the electronic component. This wiring layer configuration prevents adhesive from flowing into a separate space, thereby preventing the thickness direction deformation and overall board warping while still allowing necessary bonding to occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for overall thinning of the component built-in board while preventing deformation, simplifying the manufacturing process and enhancing the reliability of the board's insulation and mechanical strength.
Implementation Method 1
an intermediate board adjacent to the first board and comprising a first adhesive layer provided on at least a side of the first board of a second insulating layer
Data Source
AI summary
A component built-in board comprises a multi-layer structure comprising a plurality of unit boards stacked therein a plurality of electronic components built in thereto in a stacking direction. The plurality of unit boards include: a first board having a first insulating layer and comprising an opening in which the electronic component is housed; and an intermediate board adjacent to the first board and comprising a first adhesive layer provided on at least a side of the first board of a second insulating layer. The intermediate board includes a first wiring layer formed at a position overlapping in the stacking direction a gap between an inner periphery of the opening and an outer periphery of the electronic component of the first board on a surface on the first board side of the second insulating layer.