Component Carrier Constricted Through Hole for Uniform Insulating Coating

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Solution Overview

Problem

Existing component carriers face challenges in creating holes with high precision and mechanical robustness, particularly in accommodating components with small spacing and ensuring electrical reliability under harsh conditions.

Innovation Solution

A component carrier design featuring a through hole with lateral constriction in its sidewalls, coated with an electrically insulating material, formed by laser drilling from both sides of the stack, ensuring homogeneous coating thickness and improved adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a through hole is formed in a component carrier stack, then electrical connectivity and component accommodation are enabled, but mechanical robustness and structural stability deteriorate

Engineering Contradiction:

Improveelectrical connectivityVSAvoidmechanical robustness

Core Design Contradiction:

Ease of operationVSStrength

Solution Approach 1:

The through hole is segmented into two parts by forming a lateral constriction in the middle section. This creates an upper through hole portion and a lower through hole portion that are narrower in the middle, allowing the hole to pass through the stack while maintaining structural integrity in the constriction region.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The sidewalls of the through hole have different geometries at different locations. The lateral constriction creates a localized narrow region in the middle of the stack, while the upper and lower portions near the main surfaces are wider. This local variation in geometry allows the through hole to provide electrical connectivity while the constriction region maintains mechanical strength.

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If conventional drilling methods are used, then through holes can be formed, but manufacturing precision and coating homogeneity worsen

Engineering Contradiction:

Improvethrough hole formationVSAvoidhole symmetry and coating uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

Conventional mechanical drilling methods are replaced with laser processing. The laser beam forms the through hole by ablation, enabling precise control of the hole geometry including the lateral constriction. This substitution of mechanical drilling with laser processing achieves superior manufacturing precision, hole symmetry, and prepares the sidewalls for homogeneous coating application.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The laser processing parameters are optimized to create the specific geometry of the through hole with lateral constriction. By controlling laser power, pulse duration, and scanning speed, the process achieves precise hole formation with symmetric sidewalls that facilitate uniform coating deposition, overcoming the limitations of conventional drilling.

Inventive Principle:

Principle #35Parameter changes

3Device complexity

If the through hole sidewalls are left uncoated, then manufacturing complexity is reduced, but electrical reliability and corrosion resistance deteriorate

Engineering Contradiction:

Improvecoating structureVSAvoidelectrical reliability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The electrically insulating coating serves multiple functions simultaneously: it provides electrical isolation to prevent short circuits between conductive elements, protects the sidewalls from corrosion, and maintains the structural integrity of the through hole. This multi-functional coating justifies the additional manufacturing steps by delivering multiple benefits.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The component carrier stack combines different materials including the substrate material, electrically conductive layer structures, electrically insulating layer structures, and the electrically insulating coating. This composite structure leverages the properties of each material to achieve electrical reliability, mechanical strength, and corrosion resistance that single materials cannot provide.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves a highly symmetric and stable through hole with uniform coating, enhancing mechanical integrity and protecting against corrosion, while allowing for efficient component accommodation and electrical connectivity.

Implementation Method 1

forming a through hole extending vertically through the stack and being delimited by sidewalls of the stack having a lateral constriction in between opposing main surfaces of the stack

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS20250267795A1Component Carrier With Constricted Through Hole and Electrically Insulating Coating

Publication Date: 2025.08.21 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

A component carrier which includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, a through hole extending vertically through the stack and delimited by sidewalls of the stack having a lateral constriction between opposing main surfaces of the stack, and an electrically insulating coating covering part of the opposing main surfaces and at least part of the sidewalls of the stack.