Component Carrier with Dual-Diameter Bore for Thermal Management
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) face challenges in achieving effective heat transfer due to the small diameter of bores, which limits their ability to manage heat dissipation efficiently, especially when a high number of vias are required for both electrical connectivity and heat transfer.
Innovation Solution
A component carrier with a bore structure featuring a first section of larger diameter and a second section of smaller diameter, filled with thermally conductive material, such as copper, to enhance heat transfer capabilities while maintaining precise electrical connectivity, using mechanical drilling to form the bore with a dual-diameter drill bit or counter bore design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If small diameter bores are used to maintain small connection pads and sufficient space in the component carrier, then the component carrier can accommodate more vias, but the heat transfer capacity is reduced
Solution Approach 1:
The bore is divided into two distinct sections: a first section with a larger diameter for heat transfer and a second section with a smaller diameter for electrical connection. This segmentation allows each section to optimize its specific function - the larger first section provides enhanced heat transfer capacity while the smaller second section maintains small pad size and allows high via density
Solution Approach 2:
Different sections of the bore are assigned different diameters to fulfill different functions locally. The first bore section has a larger diameter specifically for heat transfer, while the second bore section has a smaller diameter for electrical connectivity. This local differentiation resolves the contradiction by providing both high heat transfer capacity and small pad size simultaneously
2Productivity
If high-speed mechanical drilling is used to manufacture component carriers with thousands of vias in short time, then productivity increases, but maintaining very small manufacturing tolerances for bore size becomes more difficult
Solution Approach 1:
The drilling process is segmented into two sequential operations: first drilling the larger diameter first bore section, then drilling the smaller diameter second bore section. This segmentation allows each drilling operation to be optimized independently - the first drill can use larger tolerances appropriate for its size, while the second drill achieves the precise small dimensions needed for electrical connection, maintaining overall manufacturing precision despite high-speed production
3Area of stationary object
If small diameter bores are used to keep connection pads small, then space for more vias is available, but the aspect ratio increases leading to more plating defects
Solution Approach 1:
The bore structure is segmented into two sections where the first section provides a larger diameter that reduces the aspect ratio for plating operations, minimizing plating defects. The second section maintains the smaller diameter needed for small pad size. This segmentation allows the plating process to occur in a more favorable geometric configuration while still achieving the desired small external pad dimensions
Solution Approach 2:
The first bore section with larger diameter is created first to establish a favorable aspect ratio for subsequent plating operations. This preliminary action of creating the larger bore section first ensures that plating can be performed with fewer defects before the smaller second section is drilled, preventing plating quality issues that would occur if only a small diameter bore were created
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat transfer efficiency by increasing the surface area for heat radiation while reducing the aspect ratio, minimizing plating defects, and allowing for smaller pad sections, thus enhancing the reliability and reducing thermal stress within the component carrier.
Implementation Method 1
The component carrier further comprises a thermally conductive material filling substantially the entire bore
Data Source
AI summary
A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure with a bore extending into the layer stack. The bore includes a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter. The component carrier further comprises a thermally conductive material filling substantially the entire bore. The bore is in particular formed by mechanical drilling.