Printed Circuit Aspects TRIZ Cases

A memory module integrates a screen and power conversion circuit to display text and images directly on the substrate.

A conductive oxide sintered body with a perovskite-type crystal structure achieves high room temperature electrical conductivity.

A printed circuit board uses a photocurable resin layer to form fine inner patterns and vias.

Single-step lamination with conductive paste-filled interposers prevents trace migration and eliminates drilling-induced impedance discontinuities.

A component carrier uses a dual-diameter bore filled with copper to enhance heat transfer efficiency.

Curved base substrates and layered films bridge reduced pad areas, enabling reliable electrical connections despite manufacturing constraints.

Spray-applied solder resist prevents copper foil corrosion while simplifying manufacturing complexity.

An integrated digital band merges conductive yarns with textile structures, eliminating piece-by-piece connection steps that extend manufacturing time.

Replacing silver with copper powder in a polymer thick film reduces production costs while maintaining reliable conductivity through photonic sintering.

Embedding a processor in the connector housing extends signal propagation distance while reducing PCB space consumption.

Asymmetric metal post design with larger embedded portion unevenness prevents peeling and migration under thermal stress.

Chemical etching replaces mechanical drilling to prevent flexible board warping while ensuring electrical conductivity.

Planarization layer fills substrate height differences to stabilize micro light-emitting device placement and improve connection reliability.

Self-guiding dual-level pads align connector pins at 0.5 mm pitch to prevent electrical shorts and disconnections.

A display panel uses a non-flexible circuit board as an intermediary to connect flexible and control boards.

A connector housing fastens multiple circuit boards together, eliminating separate mechanical fasteners to reduce assembly time and production costs.

A PCB pad uses an insulation body and a metal reflow portion to support electronic components during assembly.

Agitated reservoir flood box cleans low standoff components on conveyorized printed circuit boards.

Removing QSFP-to-SFP adapters eliminates electromagnetic interference and improves heat dissipation for high-performance optical interconnects.

Variable interconnect thickness reduces electrical resistance without compromising flexibility or mountability in compact designs.

A flexible printed circuit board integrates high and low frequency wiring into a stacked double-layer structure.

Direct bonding and a light shielding film eliminate soldering, reducing manufacturing complexity while preventing fluid ingress.

Thermally conductive fan housings dissipate heat through continuous airflow, resolving cooling limitations in sealed enclosures requiring explosion protection.

Integrating circuit leads into the bracket body consolidates wire harnesses, reducing assembly time and packaging volume.

A microstrip line with a proximate short circuit provides electrostatic discharge protection for radio frequency ports.

An EMI gasket seals openings in a receptacle cage top wall to provide electrical shielding for pluggable modules.

A sputtered first metal layer provides surface properties that prevent peeling and distortion during electroplating of sub-10 μm circuits.

Symmetrical laminate structures minimize thermal impedance and electrical signal loss in core-less substrates, resolving warping and cost issues.

Conductive adhesive laminates flexible thin film photovoltaic cells to a transparent top sheet, preventing soldering damage and reducing interconnection costs.

Thermal predetermined breaking points interrupt current flow, while fire containment devices prevent inflammation spread to surrounding circuit board regions.

Hollow tubular structures in a metal core PCB allow fluid convection, reducing thermal resistance and weight compared to solid aluminum heat sinks.

Segmented conductive micro scale traces deposit over transparent layers to enhance electrical conductivity without compromising optical clarity.

A printed circuit body positions a metal bus bar and insulator layer at an identical plane to form a continuous conductor layer across both surfaces.

NC pins between differential and ground pins in FPC connectors increase characteristic impedance to reduce high-frequency signal mismatch.

Varying width conductive pillars eliminate wing structures to resolve thermal stress and bonding reliability issues in semiconductor packaging.

A multi-layer printed circuit board integrates a dielectric waveguide with coaxial vias to radiate and receive electromagnetic signals.

Stepped connection pads on a memory module substrate reduce insertion force by allowing connector pins to deform gradually during socket engagement.

An inspection pattern using segmented electrodes and conductive adhesive particles detects coupling state to resolve insufficient crimping defects.

Laser ablation forms precise substrate grooves for additive connection pads, resolving manufacturing precision and cost trade-offs in circuit boards.

A mesh blocking portion on a display panel substrate supports the encapsulation layer to prevent crack propagation.

A printed wiring board uses a segmented copper pad with nickel, palladium, and gold films to form metal bumps.

A surface-mountable protection device uses nested cavities to house voltage variable materials for instantaneous electrostatic discharge shunting.

Laser sintering of nickel oxide nanoparticle ink creates conductive layers on flexible substrates without thermal damage or chemical etching.

A relay member electrically connects component terminals to substrate patterns via an insulating material fixed to a conductive member.

A printed wiring board via seed layer covers inner wall surfaces to enable reliable electrical connections between electrodes and wirings.

A thermally conductive body embedded in a circuit board dielectric layer transfers heat laterally to edge-mounted sinks.

Actuators adjust internal pressures in segmented coolant chambers to tailor nozzle spray intensity, resolving uneven heat distribution across heating areas.

A dual-surface backplane places driver electronics on the reverse side to keep the front viewing area entirely active.

Distinct glass layer regions with varying transmittance prevent light interference between opposing wiring layers, ensuring inspection accuracy.

A dual layer printed circuit board assembly uses a bent thermal superconducting medium to transfer heat from power components to casings.