PCB Pad With Insulation Body And Metal Reflow Portion
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Solution Overview
Problem
Existing PCB pads for SMT processes are not suitable for high-temperature reflow soldering and cannot be automatically attached to PCBs during the soldering process.
Innovation Solution
A PCB pad design featuring an insulation body with a metal reflow portion that is not electrically connected to the PCB, allowing for automated attachment and soldering during the SMT process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If PCB pads are fixed by adhesive, then they can be attached to PCBs, but they cannot be used in high-temperature reflow soldering
Solution Approach 1:
The PCB pad is divided into two functional parts: an insulation body that provides structural support and a metal reflow portion that enables high-temperature soldering attachment. This segmentation allows each part to perform its optimal function - the insulation body remains stable while the metal portion withstands reflow temperatures.
Solution Approach 2:
The PCB pad uses composite construction combining insulation material and metal material. The insulation body provides electrical isolation and mechanical support, while the metal reflow portion provides thermal stability and solderability at high temperatures, creating a composite structure that overcomes the limitations of single-material pads.
2Ease of manufacture
If PCB pads are fixed by hand after adding adhesive, then they can be attached to PCBs, but they cannot be attached by automated machines during soldering process
Solution Approach 1:
The metal reflow portion enables the PCB pad to attach itself to the PCB during the automated reflow soldering process without requiring manual placement or separate adhesive application steps. The pad utilizes the soldering process itself as the attachment mechanism, achieving self-service attachment.
Solution Approach 2:
The invention changes the attachment mechanism from chemical bonding (adhesive) to metallurgical bonding (soldering). By making the pad surface solderable through the metal reflow portion, it becomes compatible with automated reflow soldering processes, transforming the attachment parameter from adhesive-based to solder-based.
3Reliability
If metal reflow portion is electrically connected to PCB, then electrical connectivity is achieved, but electronic components may be damaged by external force
Solution Approach 1:
The electrical connectivity function is extracted from the structural support function. The metal reflow portion provides electrical connection to the PCB, while the insulation body provides mechanical support for electronic components. This separation allows the insulation body to protect components from external force without compromising electrical connectivity through the metal portion.
Solution Approach 2:
The insulation body acts as an intermediary between the metal reflow portion and the electronic components. It provides mechanical support and protection to components while allowing the metal portion to establish electrical connection with the PCB, mediating between structural and electrical requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the secure attachment of electronic components to PCBs, preventing damage from external pressure, while allowing for automated processing in high-temperature soldering environments.
Implementation Method 1
when the PCB passes the soldering machine, the solder may be attached on the metal reflow portion to solder the PCB pad on the PCB
Implementation Method 2
the insulation body of the PCB pad has a pick-up plane for vacuum suction by an automatic machine or an automatic arm
Data Source
AI summary
A PCB pad for a SMT process is combined on a PCB. The PCB pad includes an insulation body and a metal reflow portion disposed on the insulation body. The metal reflow portion is located on the side of the insulation body adjacent to the PCB. The metal reflow portion is not electrically connected with the PCB. Thus, the PCB pad may support electronic components of the PCB and prevent the electronic components from being damaged by an external pressure.