Display Panel Circuit Board Intermediary for Narrow Frame
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current display technologies face challenges in achieving a high screen-to-body ratio due to wide frames, which is hindered by limitations in the fabricating process, particularly in accurately connecting flexible and non-flexible circuit boards with different thermal expansion coefficients, leading to low accuracy and yield.
Innovation Solution
A display panel design that includes an array substrate connected to a first flexible circuit board, a non-flexible circuit board, a control circuit board, and a second flexible circuit board, where the non-flexible circuit board has a thermal expansion coefficient close to the control circuit board, and anisotropic conductive films are used to ensure stable connections and bending capabilities during packaging, avoiding soft-to-soft attaching and reducing frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a flexible circuit board is directly attached to another flexible circuit board (soft-to-soft attaching), then the frame width can be reduced, but the manufacturing accuracy and yield become low due to difficulty in controlling attachment precision
Solution Approach 1:
The patent introduces a non-flexible circuit board as an intermediary component between the first and second flexible circuit boards. This non-flexible board serves as a stable attachment platform with controlled thermal expansion, enabling precise mounting of the flexible boards without direct soft-to-soft attachment. The intermediary structure resolves the contradiction by providing a rigid reference frame that improves attachment precision while still allowing the overall device to achieve narrow frame width through the flexible nature of the connected boards.
2Reliability
If circuit boards with different thermal expansion coefficients are attached together, then electrical connection can be achieved, but the manufacturing yield becomes low due to thermal expansion mismatch causing connection instability
Solution Approach 1:
The patent carefully selects and controls the thermal expansion coefficient parameters of the circuit board materials. The non-flexible circuit board is designed with specific thermal expansion properties that are compatible with both flexible circuit boards, reducing thermal stress during temperature variations. This parameter optimization ensures stable electrical connections while maintaining high manufacturing yield by preventing connection failures due to thermal mismatch.
3Length of stationary object
If the frame width is narrowed to achieve high screen-to-body ratio, then the display appearance is improved, but the fabricating process accuracy becomes difficult to control
Solution Approach 1:
The patent divides the circuit board structure into multiple segments: a non-flexible circuit board and two flexible circuit boards. This segmentation allows each component to be manufactured and assembled independently with optimized tolerances. The non-flexible board provides a stable base that can be precisely manufactured, while the flexible boards can accommodate dimensional variations, collectively enabling narrow frame width while maintaining overall fabricating process accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for a narrower frame and higher screen-to-body ratio while improving manufacturing yield and precision, reducing equipment investment costs by stabilizing the thermal expansion coefficient difference and simplifying the attachment process.
Implementation Method 1
a first anisotropic conductive film provided between the array substrate and the first flexible circuit board; a second anisotropic conductive film provided between the first flexible circuit board and the non-flexible circuit board
Implementation Method 2
the first flexible circuit board and is configured to bend when the display panel is packaged
Implementation Method 3
a difference between a thermal expansion coefficient of the control circuit board and a thermal expansion coefficient of the non-flexible circuit board is smaller than a preset threshold
Data Source
AI summary
A display panel includes an array substrate, a first flexible circuit board, a non-flexible circuit board, a control circuit board and a second flexible circuit board; the first flexible circuit board is electrically connected to the array substrate; the non-flexible circuit board is electrically connected to the first flexible circuit board; the control circuit board is provided on the non-flexible circuit board and is electrically connected with the non-flexible circuit board; the second flexible circuit board is electrically connected to the non-flexible circuit board.