Non-Soldering Sensor Lens Assembly with Light Shielding
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Solution Overview
Problem
Conventional sensor lens assemblies are limited by the need for a soldering process, which restricts structural configuration improvements and requires high-temperature resistant connections, increasing material costs and production complexity.
Innovation Solution
A non-soldering sensor lens assembly configuration that includes a circuit board, optical module, sensor chip, wires, and a cover with a light-permeable sheet and opaque frame, eliminating the need for soldering and reducing high-temperature resistance requirements, while using a light shielding film to prevent fluid ingress and flare phenomena.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a soldering process is used to fix the sensor package structure onto the circuit board, then the connection strength and high-temperature resistance are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts and eliminates the soldering process from the manufacturing workflow. Instead of using solder to connect the sensor chip to the circuit board, the design directly bonds the sensor chip to the circuit board, removing the intermediate soldering step and associated complexity while maintaining connection integrity
Solution Approach 2:
The patent changes the bonding parameters by using direct bonding technology with controlled bonding pads and connection pads. The bonding process uses specific bonding pad dimensions (e.g., 0.5mm x 0.5mm) and bonding forces to achieve strong connections without requiring soldering, thus reducing manufacturing complexity while maintaining connection strength
2Reliability
If a soldering process is used to fix components, then the connection reliability is improved, but the production time and manufacturing cost increase
Solution Approach 1:
The patent performs preliminary bonding pad preparation and alignment before the actual bonding process. The bonding pads are pre-configured on the circuit board and the connection pads on the sensor chip are pre-aligned, allowing for rapid bonding without requiring complex soldering procedures, thus improving production efficiency while maintaining connection reliability
Solution Approach 2:
The patent replaces the thermal-mechanical soldering system with a direct mechanical bonding system. Instead of using heat and molten solder to create connections, the design uses direct mechanical bonding with controlled bonding pads, which eliminates the time-consuming heating and cooling cycles of soldering, thereby improving production efficiency while maintaining connection reliability
3Stability of the object's composition
If the sensor package structure is constrained by soldering requirements, then the connection stability is improved, but the structural design flexibility is reduced
Solution Approach 1:
The patent segments the connection interface into distinct bonding pads on the circuit board and connection pads on the sensor chip. This segmentation allows independent optimization of each bonding surface, enabling flexible structural design while maintaining stable connections. The bonding pads can be independently positioned and sized to match various sensor chip configurations, providing design flexibility without compromising connection stability
4Temperature
If high-temperature resistant materials are used for soldering connections, then the high-temperature resistance is improved, but the material cost increases
Solution Approach 1:
The patent extracts and eliminates the need for expensive high-temperature resistant solder materials. By using direct bonding technology, the design removes the intermediate solder layer entirely, replacing it with direct bonding between the sensor chip and circuit board bonding pads, thus reducing material costs while maintaining high-temperature resistance through the inherent thermal stability of the bonding interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies production, reduces material costs, increases product yield, and prevents fluid ingress and flare issues by eliminating the soldering process and using a light shielding film to define and block light paths effectively.
Implementation Method 1
The light-permeable sheet has two anti-reflection films that are respectively coated on two opposite sides thereof
Implementation Method 2
The opaque frame is formed on the ring-shaped notch. The opaque frame is disposed on the first surface of the circuit board, the light-permeable sheet and the sensor chip are spaced apart from each other
Data Source
AI summary
A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed on the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupled to the sensor chip and the circuit board, and a cover that overcovers the sensor chip and the wires. The cover includes a light-permeable sheet and an opaque frame. The light-permeable sheet has a ring-shaped notch recessed in an edge of an inner surface thereof. The opaque frame is formed on the ring-shaped notch and is disposed on the circuit board, the light-permeable sheet and the sensor chip are spaced apart from each other, and the sensor chip and the wires are arranged in a space that is defined by the light-permeable sheet and the opaque frame.