Flexible Printed Circuit Board With Stacked Double-Layer Structure
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Solution Overview
Problem
Conventional high-frequency signal transmission lines, such as coaxial cables, lack flexibility and efficiency in manufacturing when bundled and require complex multi-layer wiring to achieve anti-electromagnetic interference, leading to increased costs and reduced production efficiency.
Innovation Solution
A flexible printed circuit board design that combines high-frequency and low-frequency signal wiring boards, forming a stacked double-layer structure or interlocking notches to simulate multi-layer wiring, reducing electromagnetic interference and manufacturing complexity while maintaining cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If coaxial cables are bundled together to transmit multiple signals, then the number of signals that can be transmitted is increased, but the flexibility and ease of installation deteriorate
Solution Approach 1:
The patent merges multiple signal transmission functions into a single flexible printed circuit board by integrating multiple wiring layers and signal lines onto one substrate, eliminating the need to bundle separate coaxial cables while maintaining the ability to transmit multiple signals simultaneously
2Quantity of substance
If coaxial cables are bundled together to transmit multiple signals, then the number of signals that can be transmitted is increased, but the manufacturing efficiency deteriorates
Solution Approach 1:
The patent combines multiple signal transmission requirements into a single integrated flexible printed circuit board with multi-layer wiring, replacing the manual bundling and soldering of multiple coaxial cables with an automated PCB manufacturing process, thereby significantly improving production efficiency
3Object-affected harmful factors
If more than three wiring layers are disposed on the flexible printed circuit board to achieve anti-electromagnetic interference, then the anti-electromagnetic interference effect is improved, but the manufacturing process complexity and cost increase
Solution Approach 1:
The patent addresses electromagnetic interference by arranging wiring layers in a vertical stacked configuration rather than spreading them out horizontally, utilizing the third dimension (depth/thickness) to separate high-frequency and low-frequency signal lines while maintaining a compact overall structure and simplifying the manufacturing process
Data Source
AI summary
A flexible printed circuit board for connecting external modules, includes a high-frequency signal wiring board and a low-frequency signal wiring board. Side edges of the high-frequency signal wiring board and the low-frequency signal wiring board are connected to each other. The low-frequency signal wiring board is folded toward the high-frequency signal wiring board to form a stacked double-layer board structure. Each of two ends of the high-frequency signal wiring board extends to form a connecting board for connecting the external module. A flexible printed circuit board combination includes two flexible printed circuit boards.