Composite Circuit Board Warping and Conductivity
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Solution Overview
Problem
The manufacturing of composite circuit boards faces challenges with copper plating causing warping of flexible circuit boards and mechanical hole drilling leading to poor electrical conductivity.
Innovation Solution
A method involving the sequential formation of photosensitive resin layers and seed layers on copper plates, followed by exposure imaging to create gaps and conductive layers, which are then plated with copper, ultimately encapsulated with an insulation layer to form a composite circuit board with improved conductivity and reduced warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper plating is performed on the flexible circuit board, then electrical conductivity is improved, but the flexible circuit board warps
Solution Approach 1:
The patent divides the flexible circuit board into multiple segments by forming through-holes that expose the flexible board in local areas. This segmentation allows the rigid circuit board to provide structural support while the exposed flexible board portions maintain flexibility, preventing overall warping while still enabling copper plating for electrical conductivity in critical areas.
Solution Approach 2:
The patent applies copper plating selectively to specific local areas of the flexible circuit board where through-holes are formed, rather than plating the entire board. This localized approach provides necessary electrical conductivity at connection points while minimizing the warping effect that would occur with full-board plating.
2Ease of manufacture
If mechanical holes are drilled on the flexible circuit board, then connection points are created, but electrical conductivity deteriorates
Solution Approach 1:
The patent replaces mechanical drilling with a chemical etching process to form through-holes in the flexible circuit board. The etching process uses chemical reagents to remove material and create holes, which avoids the mechanical stress and edge damage associated with drilling, thereby preserving electrical conductivity while still creating the necessary connection points.
3Weight of moving object
If the composite circuit board is made thinner and lighter, then portability is improved, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The patent performs preliminary actions by pre-forming the flexible circuit board with specific thickness and flexibility characteristics before assembling the composite structure. The flexible board is prepared with controlled properties that allow it to maintain dimensional stability during subsequent manufacturing steps, enabling thin and light final products while preserving manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances production efficiency, maintains high quality, and results in a thin, lightweight composite circuit board with good electrical conductivity by avoiding mechanical drilling and ensuring effective connection between conductive layers.
Implementation Method 1
forming a first photosensitive resin layer and a bearing layer on opposite surfaces of the first plate; patterning the first photosensitive resin layer to form a plurality of first gaps by exposure imaging
Data Source
AI summary
A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.