Memory Module Connection Pads with Stepped Height for Reduced Insertion Force

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Solution Overview

Problem

The existing memory modules face potential damage and short-circuit issues due to the high insertion force required when inserted into a socket, primarily caused by the height of the connection pads.

Innovation Solution

The memory module design incorporates connection pads with a step portion and a contact portion of varying heights, arranged sequentially along the side portion of the module substrate, which reduces the initial and total insertion force by allowing connector pins to deform gradually, thereby minimizing damage during insertion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If connection pads are formed with sufficient height to ensure proper electrical connection, then electrical connection reliability is improved, but insertion force increases causing potential damage and short-circuit problems

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidinsertion force

Core Design Contradiction:

ReliabilityVSForce

Solution Approach 1:

The connection pad is divided into multiple height levels: a first height portion for initial contact and a second height portion for final electrical connection. This segmentation allows the connector pin to engage gradually, reducing peak insertion force while ensuring reliable electrical connection through the taller second height portion.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The connection pad structure transitions from a single-height design to a multi-level height design in the vertical dimension. By creating height differences between the first and second height portions, the patent solves both the electrical connection requirement (taller second portion) and the insertion force problem (shorter first portion that deforms gradually).

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If connection pads are made taller to ensure contact with connector pins, then electrical connection is improved, but the risk of damage to memory module and short-circuit between adjacent pads increases

Engineering Contradiction:

Improveelectrical connectionVSAvoiddamage and short-circuit risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The connection pad is segmented into a first height portion and a second height portion. The first height portion makes initial contact and deforms gradually under insertion force, absorbing stress and preventing damage. The second height portion remains taller to ensure proper electrical connection while being protected from excessive force by the sacrificial first height portion.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first height portion acts as a cushioning element that deforms beforehand during insertion, absorbing the impact force before the connector pin reaches the second height portion. This preliminary deformation protects the memory module from damage and prevents short-circuits between adjacent connection pads.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS8641453B2Memory module and method of manufacturing a memory module

Publication Date: 2014.02.04 SAMSUNG ELECTRONICS CO LTD

AI summary

A memory module may include a module substrate having a side portion. The side portion may be adapted or configured to be inserted into a socket of a main board. A plurality of connection pads may be arranged along the side portion. The connection pads may have a step portion of a first height from a surface of the side portion and a contact portion of a second height that is greater than the first height from the surface of the side portion. At least one semiconductor package may be mounted on the module substrate and electrically connected to the connection pads.