Fan Housing Thermal Conduction for Sealed Electronics Cooling
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Solution Overview
Problem
Existing cooling methods for electronic components in closed housings, such as those requiring explosion protection or high cleanliness, are limited as they cannot exchange air with the environment, necessitating alternative cooling solutions.
Innovation Solution
A closed housing device with a fan generating a continuous air flow, utilizing a channeling element to direct airflow between circuit boards and a thermally conductive fan housing for effective cooling, where the fan is housed within a holder connected to a conductive circuit board and thermally coupled to the housing wall for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the housing is designed as a closed enclosure for explosion protection or cleanliness, then protection and cleanliness are improved, but air exchange with the environment is not possible, worsening cooling capability
Solution Approach 1:
A fan is introduced as an intermediary device within the closed housing to generate air flow that cools electronic components without requiring openings in the housing. The fan creates circulation patterns that divert air flow away from heat sources, enabling cooling while maintaining the sealed enclosure for explosion protection.
Solution Approach 2:
The invention uses pneumatic principles by employing a fan to generate controlled air flow within the closed housing. The fan creates pressure differences and circulation patterns that enable heat dissipation through convection without compromising the sealed enclosure integrity.
2Temperature
If heat sinks are used to conduct waste heat away from components, then cooling is achieved, but the device complexity increases
Solution Approach 1:
The fan is designed to cool itself and surrounding components through its own operation. By positioning the fan such that it generates air flow over its housing and surrounding areas, the system achieves self-cooling without requiring separate dedicated cooling components for the fan itself.
Solution Approach 2:
The fan serves multiple functions: it cools electronic components on circuit boards, cools itself through its housing, and creates overall air circulation within the closed housing. This multi-functionality reduces the need for separate cooling components.
3Device complexity
If the fan is arranged directly on the housing wall for cooling, then the cooling structure is simplified, but targeted cooling of specific components is reduced
Solution Approach 1:
The fan housing is designed with differentiated thermal properties: a thermally conductive portion in thermal contact with the housing wall for heat dissipation, and a thermally insulating portion for isolating the fan motor. This local differentiation of thermal properties enables both simplified structure and effective targeted cooling.
Solution Approach 2:
The fan housing acts as an intermediary structure that facilitates heat transfer from the fan motor to the housing wall while simultaneously directing air flow over electronic components. The housing serves as both a structural support and a thermal management interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures continuous and effective cooling of electronic components, particularly in galvanically isolated areas, with targeted cooling and reduced heat transfer through the use of a thermally conductive fan housing and controlled airflow.
Implementation Method 1
the fan, during operation, generates a continuous, in particular a constant air flow for cooling the electronics
Implementation Method 2
a thermally conductive fan housing and controlled airflow
Data Source
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AI summary
Described and illustrated is a device (1) for housing electronics (2) comprising a closed housing (3) with a housing wall (4), at least one electronic component (2), a holder (5), and a fan (6) with a fan housing (7), wherein the electronic component (2), the holder (5), and the fan (6) are arranged inside the housing (3), and wherein the fan (6) is arranged in the holder (5). The objective of providing a device for housing electronics that enables alternative cooling of the electronics in a closed housing is achieved by designing the fan (6) as a fan (6) and by generating a continuous airflow for cooling the electronics (2) during operation.