Semiconductor Device Liquid Cooling With Pressure-Adjusted Nozzles
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently cooling diverse heat-generating components with varying temperature ranges, leading to suboptimal cooling performance and energy efficiency.
Innovation Solution
A semiconductor device incorporating a liquid cooling structure with multiple coolant chambers, nozzles, and actuators that adjust internal pressures based on temperature differences across different heating areas, allowing for tailored cooling capacities to match specific temperature ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single cooling structure is used for the entire semiconductor chip, then the device complexity is reduced, but the cooling efficiency deteriorates because it cannot address different temperature ranges in different heating areas
Solution Approach 1:
The semiconductor chip is divided into multiple heating areas, each with its own cooling structure (coolant chamber, nozzle, and actuator). This segmentation allows each cooling unit to be independently controlled according to the specific thermal requirements of each heating area, thereby improving overall cooling efficiency without significantly increasing system complexity.
Solution Approach 2:
Each cooling structure is customized for its corresponding heating area based on the local temperature range and heat generation characteristics. The coolant chambers are positioned and sized to match the specific thermal needs of each region, enabling localized optimization of cooling performance rather than applying a uniform cooling approach across the entire chip.
2Reliability
If cooling structures are customized for each heating area with different temperature ranges, then the cooling efficiency is improved, but the device complexity increases due to multiple coolant chambers, nozzles, and actuators
Solution Approach 1:
Multiple cooling functions are merged into a single integrated cooling system that includes coolant chambers, nozzles, and actuators working together as a coordinated unit. The heating areas are also merged into discrete zones that can be collectively managed, reducing the overall system complexity compared to having completely independent cooling systems for each area.
Solution Approach 2:
The cooling structures are designed with multi-functionality to handle different temperature ranges and heat generation patterns across various heating areas. Each cooling unit can adapt its operation to serve multiple purposes within its designated area, reducing the need for entirely separate specialized systems for each heating zone.
3Device complexity
If uniform cooling is applied across all heating areas, then the device complexity is reduced, but the energy efficiency deteriorates because cooling capacity cannot be optimized for different temperature ranges
Solution Approach 1:
The cooling system transitions from a static uniform cooling approach to a dynamic controlled system where each cooling unit can independently adjust its operation. The actuators enable real-time modification of coolant flow and pressure in response to varying thermal conditions, optimizing energy efficiency while maintaining manageable control complexity through modular design.
Solution Approach 2:
The cooling system optimizes energy efficiency by dynamically changing operational parameters such as coolant flow rate, pressure, and temperature for each heating area based on its specific thermal requirements. This parameter optimization allows the system to reduce energy consumption by applying appropriate cooling intensity only where and when needed, rather than maintaining uniform high-level cooling across all areas.
4Reliability
If multiple independently controlled cooling units are implemented, then the cooling efficiency is improved through tailored cooling capacities, but the manufacturing complexity increases
Solution Approach 1:
The cooling system is segmented into modular units (coolant chambers, nozzles, actuators) that can be manufactured separately and then assembled into the final device. This modular segmentation enables standardized manufacturing processes for each component type while allowing customization of the overall system configuration to match different heating area requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances cooling efficiency and energy efficiency by ensuring that each heating area receives the appropriate cooling capacity, effectively managing temperature variations and preventing excessive heat buildup.
Implementation Method 1
a plurality of actuators respectively provided on the plurality of coolant chambers and configured to individually adjust internal pressures of the plurality of coolant chambers
Implementation Method 2
a plurality of nozzles respectively provided on or below the plurality of coolant chambers and configured to spray the coolant toward the substrate
Implementation Method 3
each cooling area of the plurality of cooling areas may have a surface area of about 0.25 mm2 to about 30 mm2
Data Source
AI summary
Provided is a semiconductor device including a semiconductor chip including a substrate, the substrate extending along a plane; a plurality of coolant chambers spaced apart from the substrate at a certain distance in a first direction, each coolant chamber of the plurality of coolant chambers being configured to accommodate a coolant, the first direction being perpendicular to the plane; a plurality of nozzles respectively provided on or below the plurality of coolant chambers and configured to spray the coolant toward the substrate; and a plurality of actuators respectively provided on the plurality of coolant chambers and configured to individually adjust internal pressures of the plurality of coolant chambers.