Component Carrier Base Structure for High-Current Heat Spreading
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Solution Overview
Problem
Conventional component carriers face overheating issues due to high vertical currents, leading to potential failure, and there is a need for effective thermal management solutions.
Innovation Solution
A component carrier design with a heat removing and electrically conductive base structure, featuring a heat spreading angle of 45°, and a top structure that improves rigidity, combined with a copper foil and galvanic copper layers, enhances heat spreading and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high vertical currents flow through the component carrier, then power delivery capability is improved, but heat generation increases leading to overheating and potential failure
Solution Approach 1:
The patent extracts the thermal management function from the traditional insulating substrate and assigns it to a dedicated heat spreading layer made of thermally conductive and electrically insulating material. This layer is positioned between the component and the ground plane to specifically address heat dissipation without interfering with electrical functionality.
Solution Approach 2:
The patent introduces an intermediary heat spreading layer that mediates between the heat-generating component and the ground plane. This intermediate layer provides both thermal conduction path and electrical insulation, enabling efficient heat transfer while maintaining electrical isolation.
2Reliability
If conventional insulating layer structures are used, then electrical insulation is provided, but thermal management capability is insufficient
Solution Approach 1:
The patent employs composite material structure combining thermally conductive and electrically insulating properties in the heat spreading layer. This composite approach allows simultaneous achievement of thermal management and electrical insulation functions that cannot be realized with conventional single-material substrates.
Solution Approach 2:
The patent applies local quality by creating a specialized heat spreading region with specific thermal and electrical properties positioned exactly where heat dissipation is needed, rather than using uniform material properties throughout the entire substrate structure.
3Temperature
If heat spreading angle is increased to 45 degrees, then heat spreading efficiency is improved, but structural complexity increases
Solution Approach 1:
The patent utilizes the vertical dimension by positioning the heat spreading layer between the component and ground plane, creating a three-dimensional heat dissipation path. This vertical arrangement achieves the desired heat spreading angle without requiring complex lateral structural modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved heat spreading and thermal management, allowing for high current applications up to 50 kW, particularly in automotive semiconductor applications, while maintaining rigidity and reducing thermal resistance.
Implementation Method 1
The component is connected to the base structure for heat spreading, in particular with a heat spreading angle α of 45°
Implementation Method 2
a component carrier (1) comprises a stack comprising at least one electrically insulating layer structure (2) and at least one electrically conductive layer structure (3)
Implementation Method 3
combined with a copper foil and galvanic copper layers, enhances heat spreading and thermal management
Data Source
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AI summary
The present invention relates to a component carrier (1) comprising a stack having at least one electrically insulating layer structure (2) and/or at least one electrically conductive layer structure (3); a heat removing and electrically conductive base structure (4); a component (5) which is connected to the base structure (4) so as to at least partially protrude from the base structure (4) and so as to be laterally at least partially covered by an electrically insulating material of the stack; and an electrically conductive top structure (6) on or above a top main surface of the component (5). The present invention also relates to a method of manufacturing such a component carrier (1).