Component Carrier Metal Layer Bending Performance
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Solution Overview
Problem
Component carriers with flexible portions face challenges in maintaining mechanical robustness and electrical reliability, particularly in resisting stress and strain, which affects their bending performance and leads to crack formation.
Innovation Solution
A component carrier with a layer stack comprising an electrically conductive or insulating structure, featuring a bendable portion where a metal layer covers at least 75% of the area, enhancing bending performance and reducing defect formation by optimizing strain deformation and material stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible portion is provided in the component carrier, then adaptability and versatility are improved, but mechanical robustness and electrical reliability deteriorate due to stress and strain resistance issues
Solution Approach 1:
The patent changes the material parameter by replacing resin with metal in the bendable portion, fundamentally altering the mechanical properties to achieve both flexibility and stress resistance simultaneously
Solution Approach 2:
The patent creates a composite structure by combining metal layers with insulating layer structures in the bendable portion, achieving a material composition that provides both flexibility and mechanical robustness
2Reliability
If the metal layer covers a large area of the bendable portion, then bending performance is improved, but device complexity increases
Solution Approach 1:
The metal layer serves multiple functions simultaneously: it provides mechanical strength for bending performance, acts as an electrically conductive layer structure for electrical connectivity, and contributes to heat dissipation, thereby reducing the need for separate dedicated structures
Data Source
AI summary
A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.