Circuit Bendability/Stretchability TRIZ Cases

A wearable device uses a movable detection electrode to collect electrocardiosignal data from multiple body positions.

Resin tunnels preserve insulation layer thickness in thinned bending regions, preventing cracks during repetitive folding.

Buffer regions with torsion portions absorb deformation from assembly tolerances, preventing crack propagation in printed circuit boards.

Step-like insulating shoulders in a flexible circuit board allow selective electrical connections, reducing manufacturing complexity for medical devices.

An overhanging electronic component island design decouples rigid electronics from a flexible substrate via a single connection-support pad.

Auxetic mesh substrates expand laterally when stretched, reducing image distortion while temporary tethers hold the structure until assembly.

Relocating grounding from the display border to the edge prevents surface protrusion and burn-in while maintaining rigidity.

Segmented bent portions in a flexible circuit board distribute bending stress, preventing cracks and short circuits in COF modules.

Distinct insulating layer thicknesses and a specific boundary angle prevent photolithographic defects while maintaining wiring trace reliability.

A flexible stretchable structure uses a substrate layer and metal layer with conductive gel for electrical connectivity.

A conductive support washer stiffens thin conductor tracks at contact regions to prevent mechanical deformation during pin insertion.

A flexible substrate connects input and output terminals at different heights to spatially separate transmission and reception signals within an optical module.

Bend elastomer substrate with controlled tensile modulus then plate conductive pattern to prevent breakage during expansion.

Room-temperature polymer casting transfers graphene circuits to biodegradable substrates without thermal damage or chemical etching.

Waveform structures on the flexible printed circuit board cross-section absorb external forces, preventing conductive layer breakage during device vibration.

A transmission control unit electronic module uses a media-tight lacquer coating to protect semiconductor components and connecting elements.

A component carrier features a metal layer covering at least 75% of its bendable portion to enhance mechanical robustness.

Reducing the first boundary extension length in the bending area enlarges rounded corners while maintaining wiring coverage and reducing stress concentration.

A flexible printed circuit board uses a protruding lead portion to connect directly to an optical module substrate without vias.

An extension layer buffers stress between a hard member and stretchable wiring line on a flexible substrate.

A stretchable anisotropic conductive film bonds a fabric circuit electrode to a chipset, enabling reliable electrical connections on flexible wearable substrates.

A reinforcement plate interposed between a thin electro-optical substrate and a folded flexible circuit board increases local structural strength.

A flexible printed circuit board with a fixed bent portion and a rigid mold layer supports semiconductor chips in a compact form.

A rigid insulating member envelops flexible resin substrates to maintain their relative positional relationship in compact assemblies.

A flexible printed circuit film with a protruding portion and attached stiffener enables precise jig alignment, preventing misalignment of thin films.

Flexible micro-fabricated electrode arrays conform to neural tissue, reducing gliotic scarring and enabling selective stimulation with lower charge thresholds.

Segmented thin film patterns in the crack prevention layer absorb stress at the folding axis to restrict crack propagation and maintain display stability.

Segmented ultra-thin layers resolve the thickness-stretchability contradiction, enabling skin-conformable PCBs without invasive adhesives.

A lens driving device stabilizes magnet-coil spacing via a base guide portion, preventing height deviations during assembly.

A foldable substrate portion aligns optically active devices with transmission axes to enable automated surface mount assembly.

A ribbon-shaped illuminant device uses a substrate with varying flexural rigidity to bend into three-dimensional shapes.

Segmenting the thermoplastic substrate via a grid-like stress relief layer prevents buckling and wrinkle formation during non-flat device deformation.

Spherical organic beads in the insulator film create surface asperities that mechanically interlock with thermosetting adhesive.

Nested housings segment the circuitry of a foldable display device, resolving the trade-off between miniaturization and structural complexity.

Supports maintain conductive portions away from the substrate, reducing stress and fatigue during deformation.

Creased flexible printed circuits form controlled service loops using elastic members, preventing signal trace damage from abrupt bending.

Embedded rigid block members in flexible substrates maintain dimensional stability and thermal resistance while enabling high circuit density.

A leading electrode film connects electronic elements and expandable conductors across three surfaces to ensure stable electrical contact.

Segmented metal-core printed circuit boards deform in-plane to match lighting fixture dimensions, eliminating trimming waste.

Segmenting printed circuit boards into parts with contact portions eliminates wire twisting and core hole operations, reducing manufacturing complexity.

A mounting structure uses a protection resin and a narrow reinforcing material to shield the connection unit on a flexible wiring board.

A shape-retaining film with a plastic-deformable metal layer prevents deformed flexible wiring boards from reverting to their original shape.

Expansion bonding portions distribute connection pins across multiple edges to resolve the contradiction between display resolution and bonding region width.

A flexible printed circuit connecting head uses a reinforcement plate to strengthen the plugged part and enable plug-in functionality.

Polysilicon resistors at inspection pad edges block static electricity, preventing organic light emitting diode damage without signal delay.

A printed circuit board section pivots on a flexible web to align optical components, eliminating tapering effort while maintaining mechanical robustness.

Segmented flexible printed circuit strip adjusts pitch via bendable arms to resolve uniformity and precision trade-offs in 3D lighting guides.

A flexible circuit board integrates a standardized test area to enable uniform probe card usage across varying substrate dimensions.