Flexible Circuit Board Standardized Test Area Design
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Solution Overview
Problem
Flexible circuit boards of varying sizes present challenges in electrical testing due to the need for different probe card specifications, leading to increased testing costs and time.
Innovation Solution
A flexible circuit board design that includes a test area between the third edge and the working area, allowing the same probe card to be used across different sizes of flexible substrates, without the need for size adjustments in the test area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If different probe cards are used for flexible circuit boards of different sizes, then testing accuracy is maintained, but device complexity and testing cost increase
Solution Approach 1:
The test area is designed with a standardized configuration that can accommodate flexible circuit boards of different sizes. The test pads are arranged in a fixed pattern within the test area, allowing a single probe card design to test multiple board sizes without requiring different probe card specifications.
Solution Approach 2:
The flexible circuit board is divided into distinct functional areas: a working area that varies in size according to different board requirements, and a standardized test area that remains constant. This segmentation allows the test area to maintain a uniform structure for consistent probing while the working area adapts to different application needs.
2Measurement precision
If different probe cards are used for flexible circuit boards of different sizes, then testing accuracy is maintained, but loss of time increases due to multiple testing processes
Solution Approach 1:
A single probe card design serves multiple board sizes through the standardized test area configuration, eliminating the need to switch between different probe cards for different board dimensions and reducing setup time.
Solution Approach 2:
The test area and test pads are pre-configured in a standardized manner before manufacturing different sized flexible circuit boards. This preliminary standardization ensures that the same probing process can be applied universally, reducing the time required for testing different board sizes.
3Ease of manufacture
If test pads are arranged outside routing area on upper and lower sides, then testing capability is provided, but device complexity increases for different board sizes
Solution Approach 1:
The test area is positioned in a specific location (between the third edge and the working area) with a standardized configuration, while the rest of the board (working area) can vary in size. This local standardization maintains testing capability without requiring overall board configuration changes.
Data Source
AI summary
A flexible circuit board includes a flexible substrate, a chip, a first test area, first test pads and a circuit layer connected to the chip and the first test pads. A working area and a non-working area are defined on an upper surface of the flexible substrate. The chip is disposed on the working area, the first test area is located within the non-working area and between a third edge and the working area, the first test pads are arranged on the first test area. Flexible circuit boards with different sizes can have the first test area with the same size and can be tested using a probe card with the same specification to lower testing cost.