Resin Substrate Combined Structure with Rigid Insulating Member
Solution Overview
Problem
Existing resin substrate combined structures fail to maintain a desired relative positional relationship between multiple substrates in limited spaces, leading to variations in electrical characteristics and potential disconnection due to electromagnetic interference and bending stress when multiple flexible circuit boards are adjacently disposed.
Innovation Solution
A resin substrate combined structure that includes a first and second flexible resin substrate with an insulating member of higher rigidity enveloping them, allowing for controlled spacing and maintaining a desired positional relationship, which can be adjusted to either increase or maintain distance between substrates as needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple flexible resin substrates are adjacently disposed in a limited space, then the space utilization is improved, but the relative positional relationship between substrates cannot be maintained and electromagnetic interference occurs
Solution Approach 1:
A resin substrate holding member is introduced as an intermediary component between multiple flexible resin substrates. This holding member has a higher rigidity than the substrates and provides recesses that securely hold each substrate, maintaining their relative positional relationships. The intermediary holding member prevents direct contact between substrates, eliminating electromagnetic interference while allowing multiple substrates to be disposed in a limited space.
Solution Approach 2:
The rigidity parameter of the holding member is specifically designed to be higher than that of the flexible resin substrates. This parameter change ensures that the holding member maintains the structural integrity and positional relationships of the substrates, while the substrates retain their flexibility for bending and connection. By changing the rigidity parameter of the supporting structure, the system achieves both compact arrangement and stable electrical characteristics.
2Volume of moving object
If flexible resin substrates are disposed close together, then the device size is reduced, but bending stress causes interconnect disconnection
Solution Approach 1:
The resin substrate holding member serves as a mediator that distributes and manages bending stress. When the flexible substrates need to bend for connection, the holding member's higher rigidity provides a stable reference structure, ensuring that bending occurs in controlled manner that prevents interconnect disconnection. The intermediary structure allows compact device size while protecting the mechanical integrity of connections.
Solution Approach 2:
The holding member is designed beforehand to accommodate and cushion the bending stress that will occur during substrate connection. By providing a pre-designed structural framework with appropriate rigidity, the system prepares for potential mechanical stress, preventing interconnect disconnection before it can occur during assembly or operation.
3Device complexity
If no rigid support structure is used, then the device complexity is reduced, but the relative positional relationship between substrates varies
Solution Approach 1:
Rather than making the entire device structure rigid and complex, the invention applies local quality by providing rigidity only where needed - in the holding member that supports the substrates. The flexible substrates themselves remain soft and flexible for their intended function. This localized application of rigidity maintains manufacturing precision for positional relationships without unnecessarily increasing overall device complexity.
Solution Approach 2:
The system uses a composite structure combining flexible resin substrates with a more rigid resin substrate holding member. This composite approach allows each component to have its own optimal properties - the substrates remain flexible for connection and signaling, while the holding member provides the necessary rigidity for maintaining positional relationships. The composite structure achieves manufacturing precision without excessive complexity.
Data Source
AI summary
A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.