Flexible Circuit Board Stress Distribution via Segmented Bent Patterns

The circuit pattern is divided into multiple pattern parts with different lengths. The longest pattern part includes first and second bent portions that are segmented along its length, while shorter pattern parts have fewer or no bent portions. This segmentation allows different regions to experience and distribute bending stress differently, preventing crack propagation throughout the entire circuit pattern while maintaining electrical connectivity.

Different regions of the circuit pattern are given different structural characteristics. The longest pattern part includes additional bent portions at specific locations to distribute stress locally, while shorter pattern parts maintain simpler structures. This local differentiation ensures that stress concentration is managed where needed without compromising the overall electrical performance or requiring uniform structural modifications across all pattern parts.

The fine-pitch circuit pattern is segmented into multiple pattern parts with different lengths. The longest pattern part includes first and second bent portions that segment the continuous structure, creating multiple stress distribution points. This segmentation prevents crack propagation through the entire fine-pitch pattern while maintaining the high resolution characteristics enabled by the fine pitch design.

The solution adds a dimensional aspect by introducing bent portions at specific locations along the length of the longest pattern part. This creates a three-dimensional structure with multiple levels of stress distribution, allowing the circuit pattern to accommodate bending forces without compromising the fine-pitch trace integrity or display resolution.