Buffer Structure for Semiconductor External Terminals
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Solution Overview
Problem
Semiconductor devices face reliability issues due to dimensional and assembly tolerances, leading to deformation and damage of external terminals and printed circuit boards during the manufacturing process, which affects the overall performance and reliability of the device.
Innovation Solution
A semiconductor device design featuring a printed circuit board with buffer regions surrounding through holes, including buffer holes and torsion portions, which absorb deformation and prevent crack propagation, ensuring reliable soldering and electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external terminals are press-fitted into through-holes of the printed circuit board, then electrical connectivity is established, but deformation and damage occur due to height variation caused by dimensional and assembly tolerances
Solution Approach 1:
The patent introduces buffer regions with buffer holes and torsion portions around the through-holes in the printed circuit board. These buffer regions act as a cushioning mechanism that absorbs deformation and stress before they can reach the external terminals or critical areas of the printed circuit board, thereby preventing damage while maintaining electrical connectivity
Solution Approach 2:
The patent modifies the structural parameters of the printed circuit board by adding buffer regions with specific geometric features (buffer holes and torsion portions). This changes the mechanical properties of the board in the vicinity of the through-holes, allowing it to accommodate height variations and deformation without compromising the strength of the external terminals or causing damage
2Stability of the object's composition
If the printed circuit board is made more rigid to prevent deformation, then structural stability improves, but stress concentration increases leading to crack propagation
Solution Approach 1:
The patent divides the printed circuit board structure into distinct functional regions: support regions for mechanical strength, buffer regions with buffer holes for stress distribution, and torsion portions for controlled deformation. This segmentation allows each region to perform its specific function, preventing crack propagation while maintaining overall structural stability
Solution Approach 2:
The buffer regions act as intermediary elements between the rigid support regions and the external terminals. These intermediary buffer regions with torsion portions absorb and distribute stress, preventing direct transmission of harmful forces that could cause crack propagation in the printed circuit board
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer regions effectively reduce damage to the printed circuit board and maintain electrical conductivity, enhancing the reliability and performance of the semiconductor device by absorbing deformation and preventing crack propagation.
Implementation Method 1
a plurality of buffer regions respectively surrounding the plurality of support regions, each buffer region having at least one buffer hole and at least one torsion portion formed therein
Data Source
AI summary
A semiconductor device, including a first board, a second board having a plurality of through holes passing therethrough, and a plurality of external terminals that are respectively press-fitted into the plurality of through holes of the second board, one end portion of each external terminal passing through the corresponding through hole and being fixed to a front surface of the first board. The second board is a printed circuit board that further includes, in a top view thereof, a plurality of support regions, each having one of the plurality of through holes formed therein, and a plurality of buffer regions respectively surrounding the plurality of support regions, each buffer region having at least one buffer hole and at least one torsion portion formed therein, the at least one torsion portion being connected to the support region surrounded by each buffer region.