Rigid-Flex PCB With Embedded Block Members For Dimensional Stability
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Solution Overview
Problem
The increasing demand for high circuit density in rigid-flexible printed circuit boards for high-performance devices requires innovative solutions for mounting electronic devices on flexible substrates while maintaining dimensional stability and thermal resistance.
Innovation Solution
A printed circuit board design featuring a first rigid substrate and a second flexible substrate with embedded block members and circuit patterns, utilizing flexible insulating layers and materials like polyimide and liquid crystal polymer for enhanced bendability and thermal stability, along with metal alloys for increased strength and low thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate is used to enable bending and confined space mounting, then adaptability and ease of operation are improved, but dimensional stability and manufacturing precision deteriorate
Solution Approach 1:
The patent employs a composite structure consisting of a flexible substrate combined with rigid block members (first and second block members). The flexible substrate provides bendability for confined space mounting, while the rigid block members embedded within it provide dimensional stability and structural support, resolving the contradiction between flexibility and dimensional precision
Solution Approach 2:
The patent applies local quality by making different portions of the structure have different properties: the substrate is flexible to allow bending, while specific localized regions contain rigid block members that provide dimensional stability where needed. This allows the structure to simultaneously exhibit both flexible and dimensionally stable characteristics in different locations
2Productivity
If high circuit density is implemented in confined spaces, then productivity is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent utilizes three-dimensional space by embedding block members within the substrate structure, creating vertical layering and utilizing depth rather than only horizontal plane. This allows circuit components to be arranged in multiple dimensions, increasing circuit density while managing complexity through structured spatial organization
Solution Approach 2:
The patent implements nesting by placing first and second block members within the flexible substrate at different positions and orientations. These nested structural elements allow for compact arrangement of circuit components, achieving high circuit density in confined spaces while maintaining organized structure
3Manufacturing precision
If rigid structures are used to maintain dimensional stability, then manufacturing precision is improved, but adaptability and ease of operation worsen
Solution Approach 1:
The patent creates a composite structure where rigid block members are embedded within a flexible substrate. The rigid blocks provide dimensional stability and manufacturing precision where needed, while the flexible substrate surrounding them maintains overall bendability and adaptability, resolving the contradiction between rigidity and flexibility
4Ease of manufacture
If thermal expansion is not controlled, then ease of manufacture is improved, but reliability and stability deteriorate due to thermal deformation
Solution Approach 1:
The patent addresses thermal expansion by strategically positioning block members within the flexible substrate to create a structure that compensates for thermal deformation. The rigid block members serve as thermal anchors that maintain dimensional stability during temperature variations, preventing warping and deformation while maintaining manufacturing feasibility
Data Source
AI summary
A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulating layer bendable with respect to the first substrate portion. The second substrate portion includes a block member disposed in the flexible insulating layer and a circuit pattern disposed on a region of the flexible insulating layer, in which the block member is embedded.