Deformable Apparatus Spaced Conductive Portion
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Solution Overview
Problem
Existing flexible electronic devices face challenges in protecting conductive components from damage due to deformation, as forces applied to the device can cause stress and fatigue in conductive portions, leading to potential failure.
Innovation Solution
A deformable apparatus comprising a conductive portion coupled to a deformable substrate via supports, which maintains the conductive portion spaced from the substrate, reducing direct contact and stress during deformation, and featuring a serpentine configuration to distribute strain evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive portion is directly coupled to the deformable substrate, then the device achieves simple structure and ease of manufacture, but the conductive portion suffers from stress and fatigue during deformation leading to potential failure
Solution Approach 1:
A support structure is introduced as an intermediary element between the conductive portion and the deformable substrate. This support couples the conductive portion to the substrate while maintaining spacing, thereby reducing direct contact and stress transmission during deformation. The support acts as a mediator that protects the conductive portion from fatigue while preserving the functional connection to the substrate.
Solution Approach 2:
The apparatus is divided into distinct functional segments: the deformable substrate, the support structure, and the conductive portion. This segmentation allows each component to perform its specific function independently - the substrate provides structural flexibility, the support provides mechanical protection and spacing, and the conductive portion provides electrical functionality without direct exposure to deformation stresses.
2Reliability
If the conductive portion is spaced from the deformable substrate using supports, then stress on the conductive portion is reduced, but the device complexity increases
Solution Approach 1:
The support structure is implemented as a thin, flexible element that maintains spacing between the conductive portion and substrate while accommodating device deformation. This thin-film approach minimizes the added complexity and material volume while achieving the protective spacing function, making the structure more manufacturable compared to rigid support alternatives.
3Reliability
If the conductive portion is configured in a serpentine pattern, then strain is distributed evenly reducing failure risk, but the device area increases
Solution Approach 1:
The conductive portion is configured in a serpentine pattern with curved segments instead of straight lines. These curved configurations allow the conductive material to distribute strain more evenly during deformation, as the curves can accommodate bending and stretching more effectively than sharp angles or straight segments, thereby reducing stress concentration points.
Data Source
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Figure 5~6
AI summary
An apparatus and method wherein the apparatus comprises a deformable substrate (3); a conductive portion (7);and at least one support (5) configured to couple the conductive portion (7) to the deformable substrate (3) so that the conductive portion (7) is spaced from the deformable substrate (3).