Transmission Control Unit Electronic Module Lacquer Coating
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Solution Overview
Problem
Electronic components in transmission control units of motor vehicles are vulnerable to dirt and vibrations due to miniaturization, requiring effective protection against transmission fluid and adverse conditions.
Innovation Solution
A compact electronic module with a printed circuit board and semiconductor elements covered by a media-tight lacquer coating, which also covers connecting elements, ensuring reliability and ease of assembly, and optionally reinforced with a thermally conductive carrier element and a protective cap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electronic components are miniaturized to reduce size and cost, then manufacturing cost decreases, but vulnerability to dirt and vibrations increases
Solution Approach 1:
The patent applies a protective coating in the form of a thin film or shell that encapsulates the miniaturized electronic components. This coating forms a barrier against dirt and vibrations while maintaining the compact size of the components, thus resolving the contradiction between miniaturization and reliability.
Solution Approach 2:
The protective coating is applied over the electronic components to create a composite structure. This composite material approach combines the electronic components with a protective layer that resists environmental factors, allowing miniaturization without sacrificing reliability.
2Reliability
If protective compound or molding compound is used to protect circuits against transmission fluid, then protection against transmission fluid is improved, but device complexity and material usage increase
Solution Approach 1:
Instead of using bulky molding compounds, the patent employs a thin film protective coating that provides transmission fluid protection with minimal added complexity. This thin film approach maintains structural simplicity while achieving the required protection level.
Solution Approach 2:
The protective coating serves as a simple, effective barrier that can be applied directly to the circuits without requiring complex assembly structures. This approach reduces device complexity compared to traditional molding compound solutions.
3Reliability
If protective coating is applied to cover electronic components and connecting elements, then protection against transmission fluid is improved, but manufacturing process complexity increases
Solution Approach 1:
The protective coating process is merged with the existing manufacturing workflow, allowing the coating to be applied in an integrated manner during the assembly process. This reduces the need for separate, complex manufacturing steps while achieving comprehensive protection.
Solution Approach 2:
The thin film protective coating can be applied using conventional coating techniques that are already part of standard manufacturing processes, minimizing the increase in production complexity while providing effective protection.
4Loss of substance
If lacquer coating is used instead of molding compound, then material usage is reduced and production cost decreases, but protection effectiveness may be compromised
Solution Approach 1:
The lacquer coating is formulated and applied as a thin film that provides adequate protection against transmission fluid. The thin film structure uses minimal material while maintaining protective effectiveness through proper coating formulation and application techniques.
Solution Approach 2:
The protective properties of the lacquer coating are enhanced by adjusting parameters such as coating thickness, composition, and curing conditions. These parameter changes ensure that the reduced material usage does not compromise protection effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable, cost-effective, and space-saving electronic module that withstands transmission fluid exposure, with improved thermal connection and reduced material usage, facilitating faster production and easier component integration.
Implementation Method 1
The electronic component and the points where the electronic component is connected to the printed circuit board are covered with a protective coating, wherein the protective coating is a media-tight protective lacquer
Implementation Method 2
optionally reinforced with a thermally conductive carrier element and a protective cap
Data Source
AI summary
An electronic module for a transmission control unit may include a printed circuit board that has an electronic component. The electronic component may be electrically connected to a surface of the printed circuit board at least at one point. At least a portion of the electronic component that includes the at least one point may be covered with a protective coating. The protective coating may include a media-tight protective lacquer. The electronic component may be a semiconductor component contained in a housing.