Stretchable Substrate Bending for Conductive Pattern Plating
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Solution Overview
Problem
Existing methods for forming conductive patterns on three-dimensional structures with curved surfaces require high energy and lack sufficient flexibility, potentially damaging soft materials and impairing their shape and tactile sensation.
Innovation Solution
A method involving a stretchable substrate with a tensile modulus of 0.1-500 MPa and elongation at break of 100-1000% is used, allowing for bending and subsequent plating to form a conductive pattern without breaking, using a plating base and metal layer formation followed by etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If polyimide resin is used as substrate for three-dimensional molding, then structural integrity is achieved, but large amount of energy is required and flexibility is insufficient
Solution Approach 1:
The patent changes the material parameter from polyimide resin to elastomer, fundamentally altering the substrate's mechanical properties. This parameter change enables three-dimensional molding at lower temperatures (reducing energy consumption) while achieving sufficient flexibility for curved surfaces and soft objects
Solution Approach 2:
The patent uses composite material structure by combining elastomer substrate with conductive pattern layers (metal films, plating bases). This composite approach maintains structural integrity needed for circuit functionality while the elastomer base provides flexibility and low-energy processing capability
2Shape
If polyimide resin is used as substrate, then three-dimensional molding is possible, but flexibility is insufficient and shape/touch feeling of soft objects is impaired
Solution Approach 1:
The patent changes the material parameter from rigid polyimide resin to flexible elastomer, fundamentally altering the substrate's mechanical properties. This enables the substrate to conform to curved surfaces and soft objects while maintaining three-dimensional molding capability, thus improving flexibility and adaptability without sacrificing shape-forming ability
3Ease of manufacture
If conventional substrate is used, then circuit formation is possible, but circuit may be broken by expansion/contraction operation
Solution Approach 1:
The patent changes the material parameter from rigid polyimide resin to elastic substrate material, fundamentally altering the substrate's mechanical response to deformation. This enables the substrate to undergo expansion and contraction operations without breaking the circuit, thus improving reliability while maintaining ease of manufacture
Solution Approach 2:
The patent uses composite material structure where the elastomer substrate provides mechanical flexibility and circuit protection, while the conductive pattern layers (metal films, plating bases) provide electrical functionality. This composite approach ensures circuit durability during expansion/contraction operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the simple and effective formation of circuits and wiring on three-dimensional structures with projections and recesses, maintaining flexibility and preventing breakage due to expansion/contraction, while ensuring heat resistance and component mountability.
Implementation Method 1
a stretchable substrate having a tensile modulus at 20° C. of 0.1 MPa or more and 500 MPa or less, an elongation at break of 100% or more and 1000% or less
Implementation Method 2
a conductive pattern forming step of plating the plating base after performing the bending step to form a conductive pattern on the stretchable substrate
Implementation Method 3
a conductive pattern forming step of plating the plating base after performing the bending step to form a conductive pattern on the stretchable substrate
Data Source
AI summary
One aspect of the present invention relates to a method for manufacturing a substrate with a conductive pattern, the method including: a base forming step of forming a plating base in a desired pattern on at least a portion of one surface of a stretchable substrate, wherein the stretchable substrate has a tensile modulus at 20° C. of 0.1 MPa or more and 500 MPa or less, an elongation at break of 100% or more and 1000% or less, and a storage modulus at 250° C. of 0.1 MPa or more; a bending step of bending the stretchable substrate; and a conductive pattern forming step of plating the plating base after performing the bending step to form a conductive pattern on the stretchable substrate.