Curved Semiconductor Package with Molded Rigid Arch
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Solution Overview
Problem
Semiconductor packages with curved surfaces or flexible designs face challenges in maintaining a reduced volume and improved reliability, often resulting in increased volume or degraded reliability due to their design.
Innovation Solution
A semiconductor package featuring a flexible printed circuit board (PCB) with a fixed bent portion forming an arch-shape, a mold layer providing rigidity, and a flexible portion that extends from the fixed bent portion, allowing for the attachment of semiconductor chips and wiring lines while maintaining a compact form factor and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a curved surface or flexible semiconductor package is used to be mounted on electronic devices having a curved surface, then adaptability is improved, but volume is increased and reliability is degraded
Solution Approach 1:
The flexible PCB is divided into two distinct portions: a fixed bent portion that maintains a predetermined curved shape with semiconductor chips attached, and a flexible portion that can deform. This segmentation allows the package to adapt to curved surfaces while maintaining structural integrity and reliability in the fixed portion.
Solution Approach 2:
Different portions of the semiconductor package have different mechanical properties: the fixed bent portion has rigid characteristics to ensure reliability and maintain volume reduction, while the flexible portion has compliant characteristics to enable adaptation to curved surfaces. This local differentiation resolves the contradiction between adaptability and reliability.
2Adaptability or versatility
If a curved surface or flexible semiconductor package is used to be mounted on electronic devices having a curved surface, then adaptability is improved, but volume is increased
Solution Approach 1:
By segmenting the PCB into fixed and flexible portions, the package achieves a compact form factor in the fixed bent portion where semiconductor chips are mounted, while the flexible portion can be configured to match the target surface geometry, thereby reducing overall volume while maintaining adaptability.
Solution Approach 2:
The fixed bent portion is formed with a predetermined curved shape that matches the curvature of the target electronic device surface. This curvature allows the semiconductor chips to be mounted on a compact, space-efficient geometry while maintaining adaptability to curved surfaces.
3Reliability
If the fixed bent portion is restricted from deforming, then reliability is improved, but flexibility is reduced
Solution Approach 1:
The PCB is segmented into a fixed bent portion that maintains a predetermined curved shape for reliability, and a flexible portion that can deform to provide adaptability. This segmentation allows simultaneous achievement of both reliability through deformation restriction and flexibility through the deformable portion.
Solution Approach 2:
The fixed bent portion has rigid local properties to ensure reliability and maintain structural integrity, while the flexible portion has compliant local properties to enable deformation and adaptation. This local quality differentiation resolves the contradiction between reliability and flexibility.
Data Source
AI summary
Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.