Component Carrier Cavity Geometry for Stable Paste Interconnects
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Solution Overview
Problem
Existing component carriers face challenges in maintaining high-quality electrical connections due to incomplete, insufficient, or faulty contacting, which can lead to increased signal loss, distortion, and mechanical failures, especially with increasing miniaturization and package density.
Innovation Solution
A component carrier design featuring a cavity in the insulating layer structure with a conductive paste that deforms to form a stable, high-quality electrical connection by filling the cavity to overfill and fuse with the conductive layer structures, utilizing a cavity shape and paste amount to ensure reliable adhesion and reduce shrinkage-induced failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical connection methods are used, then manufacturing process is simple, but electrical connection quality is insufficient and prone to failures
Solution Approach 1:
The cavity is pre-formed in the insulating layer structure with a specific shape (narrower at one end, wider at the other) before the conductive paste is applied. This preliminary structuring ensures that when the paste is deposited and cured, it forms a mechanically stable connection that is narrower at the interface with one conductive layer and wider at the interface with the other conductive layer, preventing shearing failures before they can occur during operation.
Solution Approach 2:
The cavity is designed with non-uniform cross-sectional dimensions along its length, creating different local geometries optimized for different functions: the narrower end provides stronger mechanical anchoring at one interface, while the wider end provides better electrical contact area at the other interface. This local variation in geometry optimizes both mechanical strength and electrical performance at different locations within the same connection structure.
2Volume of moving object
If miniaturization and package density are increased, then device size is reduced, but precision and reliability of electrical connections deteriorate
Solution Approach 1:
The electrical connection is segmented into distinct geometric zones within the cavity: a narrower first end region and a wider second end region. This segmentation allows each zone to perform its specific function optimally - the narrower region minimizes stress concentration and provides precise mechanical alignment, while the wider region ensures adequate electrical contact area, thereby maintaining connection precision even as overall device dimensions are reduced.
3Reliability
If conventional paste application is used, then manufacturing process is simple, but paste deformation causes incomplete or faulty contacting
Solution Approach 1:
The cavity is pre-formed with a specific tapered geometry before paste application, anticipating the deformation that will occur during curing. The paste is applied in a state that allows it to flow into and fill the pre-designed cavity shape, and as it cures and deforms, it naturally conforms to the predetermined geometry that ensures complete and fault-free contacting between conductive layers.
Solution Approach 2:
The cavity dimensions are specifically designed to account for and control the deformation behavior of the conductive paste during curing. By carefully selecting the cavity's initial shape parameters (narrower at one end, wider at the other), the process ensures that after paste deformation and curing, the final connection geometry achieves optimal mechanical and electrical properties without incomplete contacting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances electrical connection reliability, reduces scrap rates, and minimizes failures by providing precise, dense, and stable connections that are less sensitive to thermal stress, ensuring efficient electrical and mechanical performance.
Implementation Method 1
conductive paste that deforms to form a stable, high-quality electrical connection by filling the cavity to overfill and fuse with the conductive layer structures
Implementation Method 2
utilizing a cavity shape and paste amount to ensure reliable adhesion and reduce shrinkage-induced failures
Data Source
AI summary
Provided are a component carrier, a method for manufacturing thereof, and a component carrier assembly. The component carrier includes a stack with a plurality of electrically conductive layer structures and at least one electrically insulating layer structure. The insulating layer structure is stacked in between two electrically conductive layer structures, and the two electrically conductive layer structures are electrically connected to each other by an electrically conductive element including an electrically conductive paste provided in a cavity located between the two electrically conductive layer structures. The cavity delimited in a lateral direction by a lateral wall of the electrically insulating layer structure, the lateral wall having two opposed portions with different inclinations relative to a contacting plane between the electrically insulating layer structure and one of the two electrically conductive layer structures and with respect to a thickness direction of the stack.