Component Carrier Protective Layer for Dense Solder Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to provide a component carrier with accurate connection portions to ensure good electrical connections while minimizing the risk of defects such as electric shorts, particularly in the context of increasing miniaturization and packing density, without significant additional effort or disadvantages.
Innovation Solution
A component carrier design featuring a protective layer structure with a central portion and a peripheral portion of different thickness distributions, where the central portion is partially in contact with the exposed conductive layer and the peripheral portion extends differently, providing a wider manufacturing window and improved soldering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If connection portions are miniaturized to increase packing density, then the number of components per area increases, but the risk of electric shorts and manufacturing defects increases
Solution Approach 1:
The protective layer structure extends vertically with a peripheral portion that protrudes beyond the horizontal plane of the central portion. This three-dimensional configuration creates additional protective coverage in the vertical dimension, preventing solder bridging between closely spaced connection portions while maintaining miniaturization benefits
Solution Approach 2:
The protective layer structure has non-uniform thickness distribution, with a peripheral portion that is thicker and extends beyond the central portion. This localized thickening provides enhanced protection specifically at critical areas where solder bridging risk is highest, while maintaining overall miniaturization
2Quantity of substance
If connection portions are miniaturized to increase packing density, then space is saved, but manufacturing precision requirements increase
Solution Approach 1:
The protective layer structure is formed beforehand to provide a cushioning effect during subsequent manufacturing processes. The peripheral portion that protrudes beyond the central portion acts as a buffer that compensates for manufacturing tolerances and prevents defects even when connection portions are closely spaced
Solution Approach 2:
The protective layer structure changes the physical parameters of the surface by creating a three-dimensional profile with different thickness regions. This parameter change provides a manufacturing window that accommodates tolerance variations while maintaining precise electrical connections
3Reliability
If protective layer is added to protect exposed conductive portions, then reliability improves, but device complexity increases
Solution Approach 1:
The protective layer structure is segmented into two functional portions: a central portion that provides baseline protection and a peripheral portion that provides enhanced protection. This segmentation allows each portion to be optimized for its specific function while together providing comprehensive protection without excessive complexity
Solution Approach 2:
The protective layer structure serves multiple functions simultaneously: it provides electrical isolation, mechanical protection, and soldering control. The single integrated structure with its two portions accomplishes what would otherwise require multiple separate protective elements, reducing overall device complexity
Data Source
AI summary
Provided are a component carrier comprising a stack, a method for manufacturing a component carrier, and a package having a component carrier. The stack has an electrically conductive layer and a solder resist layer. The solder resist layer has at least one opening exposing a portion of the electrically conductive layer, and a protective layer is provided on the exposed portion of the electrically conductive layer. The protective layer has an at least substantially plate-shaped central portion having a first thickness distribution and an at least substantially wall-shaped peripheral portion having a second thickness distribution. The central portion at least partially contacts the exposed portion. The peripheral portion is at least partially at an external side of the central portion, and extends least partially in a direction different from a plate extension direction of the central portion, wherein the first thickness distribution is different from the second thickness distribution.