Organic Non-Polymeric Coating TRIZ Cases
- PCB Pad Surface Layout for Thermal Cycle and Drop Reliability
Region-specific Ni/Au and OSP pad finishes improve semiconductor package thermal cycling and drop reliability while limiting pad and bump cracks.
- Component Carrier Protective Layer for Dense Solder Connections
A two-part protective layer on exposed conductive pads widens soldering tolerances and helps prevent shorts in dense component carriers.
- Vertical Modular Coating Layout for Compact PCB Curing
A vertical lift moves coated substrates into an oven below the coating station, shrinking PCB coating and curing footprint without losing process quality.
- Etch Barrier Conductive Structures for Low-Loss Microelectronic Packaging
A smooth conductive structure with an etch barrier and adhesion layer cuts high-frequency signal loss while preserving dielectric adhesion.
- PCB Sacrificial Pad Mitigates Galvanic Corrosion
A sacrificial copper pad expands the exposed copper area on a printed circuit board to reduce the gold-to-copper ratio during fabrication.
- Fluorescence Measuring System for OSP Layer Thickness
A fluorescence measuring system determines organic solderability preservative layer thickness using radiation excitation and detection.