Component Carrier Through-Hole Coating for Delamination Resistance
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Solution Overview
Problem
Existing component carriers face challenges in providing mechanical robustness and electrical reliability, especially under harsh conditions, with conventional methods failing to achieve precise and homogeneous coating on through holes due to uncontrolled sidewall thickness and potential delamination.
Innovation Solution
A component carrier with a through hole design featuring lateral constriction in its sidewalls, formed by laser drilling from both sides, and an electrically insulating coating applied using a roller or pair of rollers to ensure homogeneous coverage, enhancing mechanical integrity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional drilling methods are used to form through holes, then manufacturing simplicity is maintained, but coating homogeneity and manufacturing precision deteriorate due to uncontrolled sidewall thickness
Solution Approach 1:
The through hole is designed with asymmetric sidewalls featuring a lateral constriction (narrowing) at a specific depth, creating an hourglass-like shape. This asymmetric geometry controls coating material flow and distribution, ensuring uniform coating thickness on the sidewalls while maintaining manufacturing feasibility through laser drilling processes.
2Reliability
If the through hole has vertical sidewalls, then manufacturing simplicity is maintained, but mechanical strength and reliability worsen due to potential delamination under harsh conditions
Solution Approach 1:
The through hole sidewalls incorporate curved surfaces with lateral constriction rather than straight vertical walls. This curvature design enhances mechanical interlocking between the coating and substrate, improves stress distribution, and prevents delamination under thermal and mechanical stress, while being achievable through laser drilling technology.
3Manufacturing precision
If the through hole is drilled from one side only, then manufacturing simplicity is maintained, but manufacturing precision worsens due to inability to achieve symmetric coating distribution
Solution Approach 1:
The through hole formation process is segmented into two separate drilling operations: one from the first main surface and another from the second main surface. This segmentation enables precise control of the lateral constriction position and symmetry, ensuring uniform coating distribution on sidewalls while maintaining manufacturing efficiency through optimized laser drilling parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a highly symmetric and homogeneous coating, reducing warpage and delamination risks, while providing enhanced protection against corrosion and oxidation, and allowing for efficient accommodation of components like optical sensors.
Implementation Method 1
forming a through hole extending vertically through the stack and being delimited by sidewalls of the stack having a lateral constriction
Data Source
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AI summary
The present application provides a component carrier and method for manufacturing the component carrier. The component carrier (100) comprises a stack (102) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (106), a through hole (108) extending vertically through the stack (102) and being delimited by sidewalls (110) of the stack (102) having a lateral constriction (130) in between opposing main surfaces (114, 116) of the stack (102), and an electrically insulating coating (112) covering part of said opposing main surfaces (114, 116) and at least part of said sidewalls (110) of the stack (102).