Electronic Component Housing That Traps Excess Mold Resin
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Solution Overview
Problem
Conventional surface mounting electronic components require a complex assembly process and are inflexible to size changes of the dielectric disk, necessitating a mold change, and suffer from unexpected adhesion of mold resin to the outer surface.
Innovation Solution
An electronic component design featuring a case with an accommodation part, a case cover, and a metal terminal, where the accommodation part is filled with mold resin, and the case cover lateral side portion faces the accommodation side wall to create a space that holds excess resin, preventing adhesion to the outer surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional surface mounting electronic component uses molding with exterior material after fixing dielectric disk and metal terminals in cavity, then the component is protected, but the assembling step becomes complicated and metal mold needs to be changed for size changes
Solution Approach 1:
The patent combines the protective function and the structural housing into a single integrated case structure. The case serves both as the protective enclosure and as the mounting structure for the ceramic element and metal terminals, eliminating the need for separate exterior material molding steps and simplifying the overall assembly process.
Solution Approach 2:
The case is designed to accommodate ceramic elements of different sizes through a standardized structure with adjustable features. The case serves multiple functions: protecting the ceramic element, providing structural support, enabling surface mounting, and accommodating size variations without requiring mold changes, thus achieving multi-functionality and flexibility.
2Reliability
If conventional surface mounting electronic component uses molding with exterior material, then the component is protected, but metal mold needs to be changed for size changes of dielectric disk
Solution Approach 1:
The case incorporates dynamic or adjustable features that allow it to adapt to different ceramic element sizes. This may include adjustable mounting positions, flexible sealing mechanisms, or modular components that can be reconfigured, enabling the same case structure to protect ceramic elements of varying dimensions without requiring mold changes.
Solution Approach 2:
The case design allows for parameter changes such as adjustable dimensions, configurable mounting hole positions, or variable sealing configurations. These parameter adjustments enable the case to accommodate different ceramic element sizes while maintaining protective functionality, eliminating the need for multiple mold types.
3Reliability
If mold resin is used to protect ceramic element, then the ceramic element is protected, but uncured resin may leak and adhere to outer surface
Solution Approach 1:
The patent extracts or removes the harmful effect of uncured resin leakage by providing dedicated containment spaces for excess resin. The resin storage grooves or reservoirs capture and isolate the uncured resin, preventing it from reaching and adhering to the outer surface, while still allowing the mold resin to fulfill its protective function inside the case.
Solution Approach 2:
The resin storage grooves act as an intermediary structure between the mold resin and the outer surface. This intermediate feature captures excess uncured resin, serving as a buffer zone that prevents direct contact between the leaking resin and the external environment, thus eliminating the adhesion problem.
Data Source
AI summary
An electronic component including a case including an accommodation part having an opening; a ceramic element arranged in the accommodation part; a metal terminal including an electrode connecting part connecting to the ceramic element, a mounting part exposed out of the accommodation part, and a terminal arm part connecting the electrode connecting part and the mounting part; a case cover including a closing plate part covering the opening, and a case cover lateral side portion extending in a depth direction of the accommodation part from a circumference of the closing plate part and at least partially facing against an accommodation side wall of the accommodation part; and a mold resin filling the accommodation part.