Component Mounting Device Angle Correction

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Solution Overview

Problem

The component mounting device experiences variations in mounting accuracy due to inclination of the nozzle, camera, or temporary loading stand, leading to deviations in component placement, which differ with each pickup angle.

Innovation Solution

The device loads components at an angle equal to the target mounting angle, images the upper surface, and re-picks them up to correct positional deviations, ensuring accurate mounting by maintaining consistent nozzle and imaging device orientations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the component mounting device uses a nozzle, camera, and temporary loading stand that may be inclined due to attachment error or aging, then the device can perform component mounting operations, but the mounting accuracy varies significantly with each pickup angle

Engineering Contradiction:
Improvecomponent mounting capabilityVSAvoidmounting accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system performs preliminary imaging of the component on the temporary loading stand before pickup to detect the component's actual position and orientation. This preliminary action allows the system to calculate and apply pickup angle corrections in advance, ensuring that even if the nozzle or loading stand is inclined, the component will be picked up at the correct angle for accurate mounting.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system uses camera imaging to obtain feedback on the component's position and orientation on the temporary loading stand. This feedback is processed to determine the actual pickup angle required, and the system adjusts the pickup operation accordingly. The feedback loop continues through mounting verification to ensure accuracy is maintained despite any inclination in the hardware.

Inventive Principle:
Principle #23Feedback

2Measurement precision

If the camera images the component in a state where the temporary loading stand is inclined, then the feature portion can be recognized, but the recognized position is deviated from the original position

Engineering Contradiction:
Improvefeature recognition capabilityVSAvoidfeature position accuracy
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The system introduces an intermediary coordinate transformation process between the camera image and the mounting position. The camera captures the feature position in the inclined loading stand's coordinate system, then a coordinate transformation algorithm converts this to the board's coordinate system, compensating for the inclination. This intermediary transformation ensures accurate feature position recognition despite the inclined loading stand.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If the nozzle picks up the component at an inclined angle, then the pickup operation can be performed, but the component is picked up deviated from the original position

Engineering Contradiction:
Improvepickup operation flexibilityVSAvoidpickup position accuracy
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The system dynamically adjusts the pickup angle based on the detected component orientation and the nozzle's actual inclination. Rather than using a fixed pickup angle, the system calculates the optimal pickup angle in real-time by considering the component's position on the inclined loading stand and the nozzle's inclination, then applies this dynamic adjustment to ensure accurate pickup.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentEP3771310B1Component-mounting device
Publication Date: 2023.09.20 FUJI CORP
  • EP3771310B1 patent drawingFigure 1
  • EP3771310B1 patent drawingFigure 2
  • EP3771310B1 patent drawingFigure 3

AI summary

A component mounting device is capable of mounting a component having a feature portion on an upper surface, on a board. The component mounting device picks up a component by a pickup member and loads the picked-up component on a temporary loading stand at an angle substantially equal to a target mounting angle to the board. Subsequently, the component mounting device images the upper surface of the loaded component by an upper imaging device and picks up again the loaded component. Then, the component mounting device mounts the component picked up again at the target mounting angle at the target mounting position corrected based on the positional deviation amount of the feature portion recognized by the upper surface image of the imaged upper surface.