Component Mounting Machine Head Switch Optimization
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Solution Overview
Problem
In component mounting machines for long printed circuit boards, the optimal mounting order of electronic components is difficult to define, leading to excessive switching of mounting heads and positioning of the board, which increases the total mounting time.
Innovation Solution
A component mounting machine that uses a combination of a general-purpose mounting head and a high-speed multi-nozzle head, with a mounting order control device that partitions the board into multiple areas, optimizes the mounting order to minimize head switching and positioning times, allowing the high-speed head to mount small components first and the general-purpose head to handle larger components, thereby reducing overall mounting time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the mounting order is not optimized, then the mounting process can be completed, but the number of head switches and board repositionings increases excessively, leading to increased total mounting time
Solution Approach 1:
The mounting order control device determines the optimal mounting order in advance by simulating different sequences. It calculates the total mounting time for each sequence considering head switching time and board positioning time, then selects the optimal sequence before actual mounting begins. This preliminary optimization prevents excessive head switches and repositionings during the mounting process.
Solution Approach 2:
The system dynamically adjusts the mounting sequence based on component types and their positions on the board. It flexibly switches between using the high-speed mounting head for small components and the general-purpose mounting head for other components, optimizing the process in real-time rather than following a fixed sequence.
2Productivity
If the high-speed multi-nozzle head is used to mount multiple small components at once, then mounting efficiency for small components increases, but the conveyance height is reduced causing interference with mounted components
Solution Approach 1:
The system applies different mounting head types to different locations and component types on the board. The high-speed multi-nozzle head is used specifically for mounting small components in areas where interference is not an issue, while the general-purpose mounting head is used for other components. This localized application of different mounting methods optimizes efficiency without causing interference problems.
Solution Approach 2:
The mounting order control device determines in advance which components should be mounted using the high-speed head and which should use the general-purpose head. It plans the mounting sequence to ensure that small components are mounted at appropriate times and locations, preventing interference before it occurs rather than reacting to it during mounting.
3Loss of time
If the mounting order is optimized to reduce head switching, then total mounting time decreases, but the complexity of controlling the mounting sequence increases
Solution Approach 1:
The mounting order control device automatically determines and executes the optimal mounting sequence without requiring external intervention or complex manual programming. It self-manages the complexity of sequence optimization by internally simulating and calculating the best mounting order based on component types and positions, reducing head switching time while keeping the control interface simple.
4Ease of operation
If the long printed circuit board is repositioned multiple times during mounting, then all mounting areas can be accessed, but the total mounting time increases due to repeated positioning operations
Solution Approach 1:
The mounting order control device determines the optimal mounting sequence in advance that minimizes the number of board repositioning operations. It calculates which mounting areas should be accessed in what order to reduce positioning time, then executes this pre-planned sequence during actual mounting, ensuring all areas are accessible while minimizing time loss.
Solution Approach 2:
The system dynamically plans the mounting sequence to adapt to the specific board layout and component distribution. It flexibly determines the optimal access sequence for different mounting areas based on their positions and the types of components they contain, optimizing the balance between accessibility and positioning time for each specific mounting task.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly shortens the total mounting time by reducing the number of head switches and board repositionings, maximizing the efficiency of the high-speed head and minimizing the positioning time, thus optimizing the mounting process for long printed circuit boards.
Implementation Method 1
The single nozzle head includes one suction nozzle which picks an electronic component using a negative pressure
Data Source
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AI summary
The present invention is a component mounting machine which includes a board conveyance device, a component supply device, a component transfer device which includes a mounting head and a head driving mechanism, and a mounting order control device, in which the component mounting machine partitions a long printed circuit board of a length exceeding a mounting station into a plurality of mounting areas, sequentially positions each mounting area in the mounting station and mounts the electronic components, in which an general-purpose mounting head which is capable of mounting many types of component and a high speed mounting head which is capable of mounting less types of component in comparison to the general-purpose mounting head, picks multiple electronic components at once, and conveys the electronic components at a low conveyance height are used together in the component transfer device, and in which the mounting order control device performs control to change the mounting order of the electronic components so as to reduce at least one of a number of times a mounting head which is operating is switched and a number of times the long printed circuit board is positioned. Accordingly, it is possible to provide a plural head combined use component mounting machine capable of shortening a total mounting time in which all predetermined electronic components are mounted on a single long printed circuit board.