Printed Circuit Assembling TRIZ Cases

Local resin coverage prevents solder flush during reflow, maintaining connection reliability under thermal stress.

Angular connecting structures apply biasing force to retain a heat sink, eliminating rattling and ensuring consistent thermal contact.

A mask pattern layer selectively covers electronic components to enable partial molding compound encapsulation on circuit boards.

Inclined side surfaces on printed circuit boards expose conductive layers for independent bond wire connections, overcoming flex foil limitations.

Curing conductive ink post-deformation prevents cracking and maintains electrical continuity.

A dual surface finish configuration applies distinct coatings to die and land sides of an integrated circuit package substrate.

Asymmetric metal block roughness increases contact area to suppress peeling of insulating resin layers caused by thermal expansion differences.

Embedded optical waveguides and aligned windows eliminate fiber alignment costs while maintaining signal integrity.

Printed circuit board design uses copper foil with lower heat capacity to cure thermosetting resin during reflow mounting.

Adding phosphorus to lead-free solder suppresses brittle SnNi intermetallic growth, preventing joint peeling under external impact.

Thermal field measurement replaces visual inspection for fine diameter wire bonding, resolving evaluation accuracy issues in semiconductor devices.

Flux prevention wall blocks solder flux adhesion on optical path during reflow, suppressing optical loss in opto-electronic circuit boards.

A vehicle luminaire board features convex portions protruding from its surface to protect light-emitting elements.

Aligns bare die surfaces with flexible substrates using adhesive filler to enable high-resolution inkjet printing of conductive traces.

A component mounting machine uses a control device to optimize the sequence of electronic components on long printed circuit boards.

Replacing rigid connectors with a thin adhesive film and pull-tab applicator maintains component mobility while enabling installation in tight gaps.

Backup units with integrated suction ports correct board warpage to enable accurate pressure-bonding of components onto flexible substrates.

Flexible printed circuit boards arranged in a conical structure accommodate over 100 conductors without increasing connector length.

Through holes and blind holes in a mask plate align with substrate pads to prevent stress concentration and short circuits during reflow soldering.

A printed wiring board slit accommodates substrate thermal expansion to protect solder joints from mechanical strain.

A flattening material layer covers a flexible printed circuit board to create a flat surface around an integrated circuit chip.

A suction-based adhering head removes surplus conductive balls through a mask opening, preventing extra-large bump electrodes and improving yield.

Non-conductive layers isolate external electrodes from solder fillets, dampening piezoelectric vibrations and reducing acoustic noise in mounted assemblies.

A copper-containing interlayer bonds traditional solder to silver circuit traces via low-temperature sintering.

A printed circuit board connector terminal uses a blind hole insertion space to join inner and outer conductors directly to a plug.

Thermal decomposition of organic compounds in the joining material prevents damage during sintering, eliminating high-pressure requirements.

Plastic deformation of a supportive metal layer stabilizes bend angles and parallelism, reducing conductive adhesive usage.

Plated copper posts link interposers to substrates, resolving the trade-off between reduced package dimensions and manufacturing complexity.

A capacitive coupling gasket with conductive elastomer bonds aircraft windows to frames, transferring electromagnetic energy through the structure.

Spring-loaded conductors in a cylindrical connector resist dislodgement from vibrational stress while accommodating wider circuit board traces.

Segmented wiring boards with intermediary heat conductive blocks reduce endoscope diameter while maintaining connection reliability and thermal stability.

Replacing solder with conductive adhesive prevents intermetallic growth and enables component repair.

A thin moisture-blocking insulation layer covers connection devices and substrates in power electronic switching devices.

A monolithic capacitor structure uses optimized pad and electrode spacing to minimize substrate vibrations.

A dual-support power module distributes components across two plates to balance heat evacuation and electrical connectivity.

Shaping conductive adhesive to taper away from the embedded surface prevents stress-induced disconnection between the metal slug and the component.

Fabricating circuit boards with recessed SMD and NSMD pads prevents surface scratches during assembly while ensuring reliable electrical connections.

A screen printing machine uses a shared print executing section to alternate processing between two substrate supporting tables.

Segmented multilayer capacitor design directs electrostrictive vibrations through external electrodes to the interposer substrate.

A heat sink protrusion extends through a printed circuit board opening to establish direct thermal contact with surface mount devices.

Selecting load washer thickness based on spring rate prevents PCB deflection while ensuring reliable electrical contact.

A sacrificial structure with a dummy core and low-flow material prevents delamination and wrinkling of conductive layers in coreless component carriers.

A via-hole conductor structure with a truncated-cone shape connects thin-film capacitor electrodes to the conductor portion.

Cold spray deposition embeds passive components inside thick conductive layers to minimize inductive parasitics and resistive losses while saving package area.

Rib-defined gaps confine adhesive through capillary flow, reducing coverage area to preserve signal integrity and dielectric performance.

A multi-layer printed circuit board design reduces overall thickness while maintaining high component density through strategic substrate bonding.

Segmented elastomeric compound adapts viscoelasticity to temperature, maintaining mechanical decoupling and signal quality for vehicle ultrasonic transducers.

A thin interlayer with reduced thickness enables high-density routing without adding board layers, solving connection spacing constraints.

A photosensitive insulating film covers wiring to prevent solder spreading during flip-chip bonding.

Through-board legs anchor capacitors while venting channels allow air flow during soldering, resolving space and reliability trade-offs.