Tapered Conductive Adhesive for Stress-Resistant Embedded Component Interconnect
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Solution Overview
Problem
Existing electrical component packages with metal slug interconnections are prone to disconnection due to stress-induced separation between the metal slug and the embedded surface, resulting in unreliable connections.
Innovation Solution
The use of a conductive adhesive material directly attached to the embedded surface of the electrical component, secured by an encapsulation material, provides a single interface connection that is more reliable and resistant to stress-induced disconnection, with the adhesive being shaped to anchor securely and maintain contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal slug with adhesive or solder is used to form an interconnection with the embedded surface, then electrical connection is established, but stress applied to the connection may cause disconnection due to the slug breaking away
Solution Approach 1:
The patent merges the electrical connection function and mechanical anchoring function into a single integrated conductive adhesive structure. The conductive adhesive material is shaped to form both the electrical interconnection and the mechanical anchor within the encapsulation material, eliminating the separate metal slug component and its vulnerable interfaces.
Solution Approach 2:
The patent uses conductive adhesive material as a composite solution that combines electrical conductivity with adhesive bonding properties. This composite material directly bonds to the embedded surface while maintaining electrical conductivity, replacing the metal slug-adhesive-solder multi-material assembly with a single functional material system.
2Device complexity
If connections are limited to one side of the electrical component, then the packaging structure is simplified, but the connection reliability under stress is reduced
Solution Approach 1:
The patent extends the connection from a single-side (2D) interface to a three-dimensional structure by shaping the conductive adhesive material to taper away from the embedded surface and form anchors within the encapsulation material. This dimensional extension provides mechanical reinforcement while maintaining the single-side connection approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of electrical, thermal, and optical connections by maintaining a stable interface between the electrical component and the conductive adhesive, even under stress, leading to more reliable and durable semiconductor packaging.
Implementation Method 1
The conductive adhesive material may be directly attached to the embedded surface of the electrical component
Implementation Method 2
the conductive adhesive material may be shaped to taper away from the embedded surface and may be secured to the electrical component by an encapsulation material covering the conductive adhesive
Data Source
AI summary
An electrical component package is disclosed comprising: an electrical component having an embedded surface, a structure attached to the electrical component opposite the embedded surface, a conductive adhesive directly attached to the embedded surface, where the conductive adhesive is shaped to taper away from the embedded surface, and an encapsulation material covering the conductive adhesive and the electrical component. In various embodiments, the tapered conductive adhesive facilitates the securing of the conductive adhesive to the electrical component by the encapsulation material. Also disclosed are various methods of forming an electrical component package having a single interface conductive interconnection on the embedded surface. The conductive interconnection is configured to maintain an interconnection while under stress forces. Further disclosed in a method of applied a conductive adhesive that enables design flexibility regarding the shape and depth of the conductive interconnection.