Conformal Power Delivery Structures for Embedded Passive Devices
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Solution Overview
Problem
Conventional passive device embedding in integrated circuit packages results in increased inductive parasitics, resistive losses, and space constraints due to their placement on the package substrate, leading to mechanical stress and area inefficiencies.
Innovation Solution
Embedding pre-manufactured passive devices like capacitors and inductors within a conformal power delivery structure using high throughput additive manufacturing (HTAM) techniques, such as cold spraying, to create a stiff environment that isolates devices from package stresses and reduces parasitics, while allowing for flexible attachment methods and improved power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive devices are placed on the backside of the package substrate, then electrical access is achieved, but inductive parasitics and resistive losses increase
Solution Approach 1:
The patent transitions from planar placement (top or bottom of substrate) to three-dimensional embedding within the substrate thickness. Passive devices are positioned at intermediate depths between power and ground planes, utilizing the z-dimension to create shorter current loops and reduce parasitic inductance while improving electrical connectivity.
Solution Approach 2:
Passive devices are nested within the substrate structure between conductive planes, similar to nested dolls. This embedding approach allows the devices to be surrounded by electric fields for optimal coupling while being protected and mechanically integrated into the substrate, reducing both parasitic inductance and resistive losses.
2Ease of operation
If passive devices are placed on the top side of the package substrate, then electrical access is simplified, but parasitics and losses increase due to distance from power delivery network
Solution Approach 1:
Instead of placing devices at the top surface far from power planes, the invention positions them at intermediate depths within the substrate. This vertical positioning reduces the distance to both power and ground planes, minimizing parasitic inductance while maintaining simplified electrical access through controlled via structures.
Solution Approach 2:
The substrate is designed with locally optimized regions where passive devices are embedded at specific depths tailored to their electrical requirements. Each device position is customized to minimize its specific parasitic parameters while maintaining overall ease of electrical access through the power delivery network.
3Reliability
If passive devices are placed on the substrate, then electrical functionality is achieved, but package area increases due to space requirements
Solution Approach 1:
The patent utilizes the third dimension (substrate thickness) to embed passive devices, transforming a two-dimensional area problem into a three-dimensional space utilization solution. Devices are positioned within the substrate volume rather than occupying surface area, significantly reducing the required package footprint while maintaining full electrical functionality.
Solution Approach 2:
Passive devices are nested within the substrate structure, sharing the same physical space that would otherwise be occupied by the substrate material itself. This embedding approach allows multiple devices to be integrated within the substrate volume, maximizing space utilization and minimizing the overall package area required for electrical functionality.
4Area of stationary object
If passive devices are embedded in buildup layers, then space is saved, but soldering technology creates z height and space impact
Solution Approach 1:
The patent extracts the soldering process entirely from the passive device attachment methodology. Instead of using soldering which creates z-height issues, the invention employs bump bonding technology that eliminates the need for traditional solder joints, removing the associated complexity and spatial impact while maintaining space-efficient embedding.
Solution Approach 2:
The invention replaces the mechanical soldering system with a bump bonding system. This substitution eliminates the molten solder phase and associated z-height variations, providing a more controlled and space-efficient attachment method that reduces device complexity while achieving the same electrical connectivity function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces inductive parasitics and resistive losses, saves space within the package, and enhances mechanical integrity by allowing direct contact with thick conductive layers for better heat spreading and electrical connectivity.
Implementation Method 1
embedding pre-manufactured passive devices such as capacitors, inductors, transformers, integrated passive devices (IPDs), etc. inside the relatively thick high throughput additive manufacturing (HTAM) conformal power delivery structure. An example of HTAM includes a cold spraying technique, or cold spray.
Data Source
AI summary
A embedded passive structure, a microelectronic system, and an integrated circuit device assembly, and a method of forming the embedded passive structure. The embedded passive structure includes a base layer; a passive device attached to the base layer; a first power plane comprising metal and adjacent an upper surface of the base layer, the first power plane having a portion electrically coupled to a terminal of the passive device, wherein an upper surface of a combination of the first power plane and the passive device defines a recess; a second power plane comprising metal, the second power plane at least partially within the recess and having a lower surface that conforms with the upper surface of the combination; and a liner including a dielectric layer between the first power plane and the second power plane.