Memory Module Optical Waveguide Alignment Cost Reduction
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Solution Overview
Problem
Conventional optical packaging methods for memory modules, which involve active and passive alignments using optical fibers, result in increased packaging costs.
Innovation Solution
A memory module design incorporating a printed circuit board with an embedded optical waveguide and optical windows, where the optical input/output section, second optical window, and first optical window are arranged in a line to transmit and receive optical signals, and an optical reflector is used to redirect signals, with index matching fluids or epoxy filling the spaces between the windows to prevent contamination and enhance bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional optical packaging methods utilizing active and passive alignments with optical fibers are used, then optical signal transmission is achieved, but packaging cost increases
Solution Approach 1:
The patent extracts the optical fiber from the packaging structure and replaces it with direct optical window-to-waveguide coupling. The optical fiber alignment mechanism is completely removed, keeping only the essential optical transmission function through simplified windows and reflectors.
Solution Approach 2:
The patent replaces expensive, precision-aligned optical fibers with inexpensive optical windows and reflector structures that can be manufactured using standard PCB and packaging processes, significantly reducing packaging cost while maintaining optical functionality.
2Reliability
If optical fibers are used for alignment in packaging, then optical signal transmission is enabled, but device complexity increases
Solution Approach 1:
The patent removes the complex optical fiber alignment subsystem from the packaging structure, retaining only the essential optical transmission path through windows and reflectors, thereby simplifying the overall device architecture.
Solution Approach 2:
Instead of using optical fibers to guide light from external sources, the patent inverts the approach by using the PCB waveguide itself as the primary optical path and using simple windows and reflectors to couple light directly into it, eliminating the need for fiber-based guidance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces packaging costs while enabling efficient optical signal transmission and reception, maintaining signal integrity and mechanical strength through the use of transparent fillers.
Implementation Method 1
an optical waveguide and a first optical window extending from the optical waveguide to a first surface of the printed circuit board
Implementation Method 2
The optical reflector may meet an extension line of the first section at an angle of 45 degree
Implementation Method 3
index matching fluid to enhance signal transmission
Data Source
AI summary
Provided is a memory module, a system using the memory module, and a method of fabricating the memory module. The memory module may include a printed circuit board and a memory package on the printed circuit board. The printed circuit board may include an embedded optical waveguide and a first optical window extending from the optical waveguide to a first surface of the printed circuit board. The memory package may also include a memory die having an optical input/output section and a second optical window. The optical input/output section, the second optical window, and the first optical window may be arranged in a line and the first optical window and the second optical window may be configured to at least one of transmit an optical signal from the optical waveguide to the optical input/output section and transmit an optical signal from the optical input/output section to the optical waveguide.