Monolithic Capacitor Pad Arrangement for Acoustic Noise Reduction

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Solution Overview

Problem

Existing methods for reducing acoustic noise in electronic devices, such as mobile phones, require multiple monolithic ceramic capacitors and significant space, making them unsuitable for densely assembled components like mobile terminals.

Innovation Solution

A monolithic-capacitor-mounted structure with a specific arrangement of pads and external electrodes on a substrate, where the distance between pads and external electrodes is optimized to minimize vibrations, reducing acoustic noise without the need for multiple capacitors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If four monolithic ceramic capacitors are arranged in a specific pattern to reduce acoustic noise, then acoustic noise is reduced, but the mounting space increases and device density decreases

Engineering Contradiction:
Improveacoustic noiseVSAvoidmounting space
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The patent merges the acoustic noise reduction function into a single monolithic capacitor by strategically arranging four pads and bonding members on the capacitor body. Instead of using four separate capacitors as in prior art, this invention combines multiple bonding members (first, second, third, and fourth bonding members) on one capacitor to achieve the same noise reduction effect, thereby reducing mounting space while maintaining acoustic noise reduction performance

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent segments the bonding structure into four distinct bonding members positioned at different locations on the capacitor body. The first and second bonding members are arranged in a first direction, while the third and fourth bonding members are arranged in a second direction perpendicular to the first direction. This segmentation allows for optimized stress distribution and acoustic noise reduction without requiring multiple separate capacitors

Inventive Principle:
Principle #1Segmentation

2Object-affected harmful factors

If multiple capacitors are used to reduce acoustic noise, then acoustic noise is reduced, but the device complexity and assembly difficulty increase

Engineering Contradiction:
Improveacoustic noiseVSAvoidcapacitor arrangement complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent combines the functionality of multiple capacitors into a single monolithic capacitor unit. By integrating four bonding members on one capacitor body rather than using four separate capacitors, the invention simplifies the overall device structure, reduces assembly steps, and lowers device complexity while achieving the same acoustic noise reduction effect

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single monolithic capacitor serves multiple functions: it provides the primary capacitance function and simultaneously acts as the acoustic noise reduction element through its specialized pad and bonding member arrangement. This multi-functionality eliminates the need for separate noise reduction components, thereby reducing device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly reduces or prevents acoustic noise in electronic devices by evenly dispersing bending stresses across the substrate, ensuring that vibrations in the lengthwise and widthwise directions are approximately equal, thereby minimizing sound perception.

Implementation Method 1

A plurality of pads coupled to at least one of the external electrodes using a bonding member are disposed on the mount surface of the substrate

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS9318260B2Capacitor-mounted structure and capacitor
Publication Date: 2016.04.19 MURATA MFG CO LTD
  • US9318260B2 patent drawing
  • US9318260B2 patent drawing
  • US9318260B2 patent drawing

AI summary

A monolithic-capacitor-mounted structure satisfies Lc>Wc and Lx/Wx<Lc/Wc, where Lx denotes a distance between a first-lengthwise outermost portion of a first-lengthwise outermost one of first through fourth pads and a second-lengthwise outermost portion of a second-lengthwise outermost one of the pads; Wx denotes a distance between a first-widthwise outermost portion of a first-widthwise outermost one of the pads and a second-widthwise outermost portion of a second-widthwise outermost one of the pads; Lc denotes a distance between a first-lengthwise outermost portion of a first-lengthwise outermost one of external electrodes and a second-lengthwise outermost portion of a second-lengthwise outermost one of the external electrodes; and Wc denotes a distance between a first-widthwise outermost portion of a first-widthwise outermost one of the external electrodes and a second-widthwise outermost portion of a second-widthwise outermost one of the external electrodes.