Multilayered Chip Capacitor Non-Conductive Layer Solder Overflow
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Solution Overview
Problem
Multilayered chip capacitors generate acoustic noise when voltage is applied due to vibrations transferred to the printed circuit board, causing discomfort, and existing solutions do not effectively prevent solder overflow or reduce noise.
Innovation Solution
A multilayered chip electronic component with non-conductive layers on its side surfaces and specific plating layers to reduce solder height and prevent overflow, combined with a board design that minimizes solder fillet height to decrease acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder fillet height is increased to ensure reliable soldering connection, then soldering reliability is improved, but acoustic noise increases due to vibration transfer
Solution Approach 1:
A non-conductive layer is introduced as an intermediary between the plating layer and the external electrode. This layer acts as a vibration isolation barrier that blocks the transmission path from solder fillet vibrations to the internal electrodes, thereby reducing acoustic noise while maintaining adequate solder fillet height for reliable connections
Solution Approach 2:
The non-conductive layer is pre-positioned between the plating layer and external electrode to provide cushioning against vibration transfer before the soldering process occurs. This preventive measure ensures that even with taller solder fillets needed for reliable soldering, the vibration energy is dampened before reaching the sensitive internal electrodes
2Reliability
If plating layer thickness is increased to prevent solder overflow, then solder overflow prevention is improved, but manufacturing complexity increases
Solution Approach 1:
The non-conductive layer serves as a physical barrier and intermediary structure that limits the lateral flow of solder. By positioning this layer between the plating layer and external electrode, solder overflow is prevented without requiring excessive plating thickness, thus simplifying the manufacturing process
Solution Approach 2:
The non-conductive layer is applied selectively in specific regions where solder overflow is most likely to occur. This localized approach provides effective solder containment while avoiding the need to increase plating thickness across the entire component, reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces acoustic noise by minimizing solder fillet height and preventing solder overflow, enhancing the reliability of the mounting process and reducing listener discomfort.
Implementation Method 1
non-conductive layers formed on outer side surfaces of the first plating layers
Implementation Method 2
a piezoelectric phenomenon and vibrations are generated between the internal electrodes
Implementation Method 3
a solder fillet fixing the multilayered chip capacitor to the printed circuit board
Data Source
AI summary
There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers.